Lee, So-Yeon Park, Kyung Ryoul Kang, Sung-Gyu Lee, Ji-Hoon Jeon, Eun-chae Shim, Cheol-Hwee Ahn, Jae-Pyoung Kim, Dong-Ik Han, Heung Nam Joo, Young-Chang Kim, Changsoon Choi, In-Suk 2024-01-19T19:03:52Z 2024-01-19T19:03:52Z 2021-09-04 2019-10 2041-1723 https://pubs.kist.re.kr/handle/201004/119540 While cracks are usually considered detrimental, crack generation can be harnessed for various applications, for example in ceramic materials, via directing crack propagation and crack opening. Here, we find that electron beam irradiation prompts a crack suppression phenomenon in a copper (Cu) thin film on a polyimide substrate, allowing for the control of crack formation in terms of both location and shape. Under tensile strain, cracks form on the unirradiated region of the Cu film whereas cracks are prevented on the irradiated region. We attribute this to the enhancement of the adhesion at the Cu-polyimide interface by electrons transmitted through the Cu film. Finally, we selectively form conductive regions in a Cu film on a polyimide substrate under tension and fabricate a strain-responsive organic light-emitting device. English Nature Publishing Group Selective crack suppression during deformation in metal films on polymer substrates using electron beam irradiation Article 10.1038/s41467-019-12451-8 1 Nature Communications, v.10 Nature Communications 10 Y scie scopus 000488484400008 2-s2.0-85072847681 Multidisciplinary Sciences Science & Technology - Other Topics Article IN-SITU THIN ELECTROMIGRATION MICROSCOPY DUCTILITY TOOL Crack Deformation metal films electron beam irradiation