Wang, Lei Wang, Manxiang Lu, Jinrong Ardhi, Ryanda Enggar Anugrah Liu, Jing Liu, Guicheng Lee, Joong Kee 2024-01-19T21:01:06Z 2024-01-19T21:01:06Z 2021-09-02 2019-02 1876-1070 https://pubs.kist.re.kr/handle/201004/120408 Liquid metal (In-75.4 Ga-24.5, LM) with its high electrical conductivity and flexibility at room temperature, has been gradually introduced into printed electronics. However, the low adhesion effect of LM on the common printer paper may restrict its potential value in reducing cost and expanding use. In this study, the surface property of the printer paper has been modified by a wetting method with a coating of microsize droplets on the paper surface to realize a smooth writing process using the liquid metal ink. The current strategy is expected to enable future flexible electronic circuits on the hard writing substrates. (C) 2018 Taiwan Institute of Chemical Engineers. Published by Elsevier B.V. All rights reserved. English ELSEVIER PERFORMANCE WATER Enhanced adhesion between liquid metal ink and the wetted printer paper for direct writing electronic circuits Article 10.1016/j.jtice.2018.07.003 1 JOURNAL OF THE TAIWAN INSTITUTE OF CHEMICAL ENGINEERS, v.95, pp.202 - 207 JOURNAL OF THE TAIWAN INSTITUTE OF CHEMICAL ENGINEERS 95 202 207 scie scopus 000458942000023 2-s2.0-85050674131 Engineering, Chemical Engineering Article PERFORMANCE WATER Liquid metal Printed electronics Wetting processing Printer paper Direct writing