Lee, Seok Hwan Seo, Heun Young Yeom, Yong Sik Kim, Jong Eun An, Heseong Lee, Jong-Suk Jeong, Hae-Kwon Baek, Kyung-Youl Cho, Kie Yong Yoon, Ho Gyu 2024-01-19T22:02:47Z 2024-01-19T22:02:47Z 2021-09-03 2018-08-15 0032-3861 https://pubs.kist.re.kr/handle/201004/121037 Various failure modes derived from the electrochemical migration (ECM) through the dielectric polymer layers have been considered critical issues in the electronic devices. Herein, we for the first time suggested the rationally designed epoxy/zeolitic imidazolate framework-8 (ZIF-8) nanocomposite materials for efficient suppression of copper ion migration based on the plausible reaction mechanisms of metal metathesis addressed by sequential cleaving and ligating between metal ions (Zn2+ and Cu2+) and 2-methylimidazole (2-mim) ligands. The fabrication process for epoxy/ZIF-8 (EZ) nanocomposites was first examined to optimize the crosslinking system. The capability of the metal ion capture in the EZ nanocomposites was examined using the aqueous solution containing Cu2+ ions. In addition, the ECM suppression properties were evaluated using the thermal humidity bias (THB) model testing. The representative model investigations with the EZ nanocomposites exhibited substantially enhanced copper ion adsorption and suppression of copper migration in comparison to those of epoxy. Hence, the EZ nanocomposites can be one promising material to alleviate the undesired ECM behavior in electronic device applications. (C) 2018 Elsevier Ltd. All rights reserved. English ELSEVIER SCI LTD ZEOLITIC IMIDAZOLATE FRAMEWORK-8 MECHANICAL-PROPERTIES BLOCK-COPOLYMER BEHAVIOR CONDUCTIVITY COATINGS FIBER RESIN Rational design of epoxy/ ZIF-8 nanocomposites for enhanced suppression of copper ion migration Article 10.1016/j.polymer.2018.05.062 1 POLYMER, v.150, pp.159 - 168 POLYMER 150 159 168 scie scopus 000442535600016 2-s2.0-85049945074 Polymer Science Polymer Science Article ZEOLITIC IMIDAZOLATE FRAMEWORK-8 MECHANICAL-PROPERTIES BLOCK-COPOLYMER BEHAVIOR CONDUCTIVITY COATINGS FIBER RESIN Epoxy nanocomposites ZIF-8 Copper migration suppression