Nishiyama, Nobuhiko Kang, JoonHyun Kuno, Yuki Itoh, Kazuto Atsumi, Yuki Amemiya, Tomohiro Arai, Shigehisa 2024-01-19T22:30:36Z 2024-01-19T22:30:36Z 2022-01-25 2018-07 1745-1353 https://pubs.kist.re.kr/handle/201004/121172 To realize three-dimensional (3D) optical interconnection on large-scale integration (LSI) circuits, layer-to-layer couplers based on Si-photonics platform were reviewed. In terms of optical cross talk, more than 1 mu m layer distance is required for 3D interconnection. To meet this requirement for the layer-to-layer optical coupler, we proposed two types of couplers: a pair of grating couplers with metal minors for multi-layer distance coupling and taper-type directional couplers for neighboring layer distance coupling. Both structures produced a high coupling efficiency with relatively compact (similar to 100 mu m) device sizes with a complementary metal oxide semiconductor (CMOS) compatible fabrication process. English IEICE-INST ELECTRONICS INFORMATION COMMUNICATIONS ENG Si-Photonics-Based Layer-to-Layer Coupler Toward 3D Optical Interconnection Article 10.1587/transele.E101.C.501 1 IEICE TRANSACTIONS ON ELECTRONICS, v.E101C, no.7, pp.501 - 508 IEICE TRANSACTIONS ON ELECTRONICS E101C 7 501 508 N scie scopus 000446111000011 2-s2.0-85049414543 Engineering, Electrical & Electronic Engineering Article Si photonics 3D optical interconnection layer-to-layer couplet grating