Kwon, Soon Seok Hwang, Sung Min Kim, Hyoung Ryeun Jang, Hee Chang Hong, Jeong Hoon Song, Gil Joo Park, hyun Yul Kim, Minsoo Shin, Youhwan Kim, Jin Young Noh, Tae Yong Yoo, Seoung-Kyo 2024-01-20T02:02:13Z 2024-01-20T02:02:13Z 2021-09-01 2017-03 1680-8584 https://pubs.kist.re.kr/handle/201004/122987 We analyzed defective bonding pad in various ways and determined the causes of defects that boosts oxidation of aluminium by fluoride residue on surface of pad with moisture. Additionally, we compared and evaluated methods to minimize pad defects in aspects such as etching and wafer storage environment. In case of wafers after pad open etching process using common CF4 stored in FOUP, the concentration of fluoride ions in FOUP was 230 ng L-1 and it decreased down to 170 ng L-1 when Ar sputtering step was added after using CF4. Also under the same condition, fluoride ion concentration in FOUP decreased down to 20 ng L-1 when nitrogen purge was introduced for 10 minutes to the FOUP where wafers were stored and the moisture also decreased from 40% before purge to 10% after purge. As a result of observation on pad surface after storing wafers in FOUP for 120 hours under each condition, negligible amount of defects were found when nitrogen was purged. Therefore, we conclude that defects on pad were generated by existing fluoride ions after etching process and moisture in the air. English TAIWAN ASSOC AEROSOL RES-TAAR 300 MM WAFER AIRBORNE MOLECULAR CONTAMINATION COPPER WIRE CORROSION NITROGEN Influence of Fluoride Ions Contamination in Front Opening Unified Pod (FOUP) Generating Defective Bonding Pad Article 10.4209/aaqr.2016.10.0457 1 AEROSOL AND AIR QUALITY RESEARCH, v.17, no.3, pp.936 - 941 AEROSOL AND AIR QUALITY RESEARCH 17 3 936 941 scie scopus 000398198400026 2-s2.0-85014064405 Environmental Sciences Environmental Sciences & Ecology Article 300 MM WAFER AIRBORNE MOLECULAR CONTAMINATION COPPER WIRE CORROSION NITROGEN Bonding pad Fluoride ion Etching process Contamination Front opening unified pod (FOUP)