Park, Sang Jin Ko, Tae-Jun Yoon, Juil Moon, Myoung-Woon Oh, Kyu Hwan Han, Jun Hyun 2024-01-20T02:03:14Z 2024-01-20T02:03:14Z 2021-09-01 2017-02-28 0169-4332 https://pubs.kist.re.kr/handle/201004/123042 We have examined a potential new and simple method for patterning a copper circuit on PET substrate by copper electroless plating, without the pretreatment steps (i.e., sensitization and activation) for electroless plating as well as the etching processes of conventional circuit patterning. A patterned mask coated with a catalyst material, Ag, for the reduction of Cu ions, is placed on a PET substrate. Subsequent oxygen plasma treatment of the PET substrate covered with the mask promotes the selective generation of anisotropic pillar- or hair-like nanostructures coated with co-deposited nanoparticles of the catalyst material on PET. After oxygen plasma treatment, a Cu circuit is well formed just by dipping the plasma treated PET into a Cu electroless plating solution. By increasing the oxygen gas pressure in the chamber, the height of the nanostructures increases and the Ag catalyst particles are coated on not only the top but also the side surfaces of the nanostructures. Strong mechanical interlocking between the Cu circuit and PET substrate is produced by the large surface area of the nanostructures, and enhances peel strength. Results indicate this new simple two step (plasma surface modification and pretreatment-free electroless plating) method can be used to produce a flexible Cu circuit with good adhesion. (C) 2016 Elsevier B.V. All rights reserved. English ELSEVIER SELF-ASSEMBLED MONOLAYERS LOW-TEMPERATURE INK NANOPARTICLE ELECTRODEPOSITION ELECTRONICS DEPOSITION SUBSTRATE ARRAYS Copper circuit patterning on polymer using selective surface modification and electroless plating Article 10.1016/j.apsusc.2016.12.007 1 APPLIED SURFACE SCIENCE, v.396, pp.1678 - 1684 APPLIED SURFACE SCIENCE 396 1678 1684 scie scopus 000391418200058 2-s2.0-85006848838 Chemistry, Physical Materials Science, Coatings & Films Physics, Applied Physics, Condensed Matter Chemistry Materials Science Physics Article SELF-ASSEMBLED MONOLAYERS LOW-TEMPERATURE INK NANOPARTICLE ELECTRODEPOSITION ELECTRONICS DEPOSITION SUBSTRATE ARRAYS Flexible electronics Plasma treatent Microstructure Electroless plating Cu circuit