Yu, Jaesang Cha, Ji Eun Kim, Seong Yun 2024-01-20T02:04:05Z 2024-01-20T02:04:05Z 2021-09-01 2017-02-01 1359-8368 https://pubs.kist.re.kr/handle/201004/123088 We proposed a solvent-free melting process for fabricating high-conductivity polymer composite films filled with highly dispersed GNP fillers. The excellent dispersion of GNP fillers in the composite films was observed using X-ray micro-computed tomography (micro-CT), a non-destructive three-dimensional (3D) analysis technique that helps to analyze the internal structures of composite films with precision. The excellent dispersion of GNP fillers also confirmed by the fact that experimentally determined electrical and thermal conductivity values of the composite films were well consistent with the theoretical calculations obtained with a Mod-Tanaka method. The composite films exhibited an electrical conductivity on the order of 10(1) S/m and the in-plane thermal conductivity of 7.1 W/m.K when they contained 20 wt% GNP fillers. (C) 2016 Elsevier Ltd. All rights reserved. English ELSEVIER SCI LTD CARBON-NANOTUBE COMPOSITES POLYMER COMPOSITES EDDY-CURRENT THERMOPLASTIC COMPOSITES SYNERGISTIC IMPROVEMENT ELECTRICAL PERCOLATION THEORETICAL APPROACH ENHANCED DISPERSION HEAT-FLOW FIBER Thermally conductive composite film filled with highly dispersed graphene nanoplatelets via solvent-free one-step fabrication Article 10.1016/j.compositesb.2016.11.014 1 COMPOSITES PART B-ENGINEERING, v.110, pp.171 - 177 COMPOSITES PART B-ENGINEERING 110 171 177 scie scopus 000395841600019 2-s2.0-84995773096 Engineering, Multidisciplinary Materials Science, Composites Engineering Materials Science Article CARBON-NANOTUBE COMPOSITES POLYMER COMPOSITES EDDY-CURRENT THERMOPLASTIC COMPOSITES SYNERGISTIC IMPROVEMENT ELECTRICAL PERCOLATION THEORETICAL APPROACH ENHANCED DISPERSION HEAT-FLOW FIBER Polymer-matrix composites (PMCs) Thermal properties Non-destructive testing Compression moulding