<?xml version="1.0" encoding="utf-8" standalone="no"?>
<dublin_core schema="dc">
<dcvalue element="contributor" qualifier="author">Takagi,&#x20;S.</dcvalue>
<dcvalue element="contributor" qualifier="author">Noguchi,&#x20;M.</dcvalue>
<dcvalue element="contributor" qualifier="author">Kim,&#x20;M.</dcvalue>
<dcvalue element="contributor" qualifier="author">Kim,&#x20;S.&#x20;-H.</dcvalue>
<dcvalue element="contributor" qualifier="author">Chang,&#x20;C.&#x20;-Y.</dcvalue>
<dcvalue element="contributor" qualifier="author">Yokoyama,&#x20;M.</dcvalue>
<dcvalue element="contributor" qualifier="author">Nishi,&#x20;K.</dcvalue>
<dcvalue element="contributor" qualifier="author">Zhang,&#x20;R.</dcvalue>
<dcvalue element="contributor" qualifier="author">Ke,&#x20;M.</dcvalue>
<dcvalue element="contributor" qualifier="author">Takenaka,&#x20;M.</dcvalue>
<dcvalue element="date" qualifier="accessioned">2024-01-20T03:02:25Z</dcvalue>
<dcvalue element="date" qualifier="available">2024-01-20T03:02:25Z</dcvalue>
<dcvalue element="date" qualifier="created">2021-09-05</dcvalue>
<dcvalue element="date" qualifier="issued">2016-11</dcvalue>
<dcvalue element="identifier" qualifier="issn">0038-1101</dcvalue>
<dcvalue element="identifier" qualifier="uri">https:&#x2F;&#x2F;pubs.kist.re.kr&#x2F;handle&#x2F;201004&#x2F;123491</dcvalue>
<dcvalue element="description" qualifier="abstract">CMOS&#x20;utilizing&#x20;high&#x20;mobility&#x20;III-V&#x2F;Ge&#x20;channels&#x20;on&#x20;Si&#x20;substrates&#x20;is&#x20;expected&#x20;to&#x20;be&#x20;one&#x20;of&#x20;the&#x20;promising&#x20;devices&#x20;for&#x20;high&#x20;performance&#x20;and&#x20;low&#x20;power&#x20;integrated&#x20;systems&#x20;in&#x20;the&#x20;future&#x20;technology&#x20;nodes,&#x20;because&#x20;of&#x20;the&#x20;enhanced&#x20;carrier&#x20;transport&#x20;properties.&#x20;In&#x20;addition,&#x20;Tunneling-FETs&#x20;(TFETs)&#x20;using&#x20;Ge&#x2F;III-V&#x20;materials&#x20;are&#x20;regarded&#x20;as&#x20;one&#x20;of&#x20;the&#x20;most&#x20;important&#x20;steep&#x20;slope&#x20;devices&#x20;for&#x20;the&#x20;ultra-low&#x20;power&#x20;applications.&#x20;In&#x20;this&#x20;paper,&#x20;we&#x20;address&#x20;the&#x20;device&#x20;and&#x20;process&#x20;technologies&#x20;of&#x20;Ge&#x2F;III-V&#x20;MOSFETs&#x20;and&#x20;TFETs&#x20;on&#x20;the&#x20;Si&#x20;CMOS&#x20;platform.&#x20;The&#x20;channel&#x20;formation,&#x20;source&#x2F;drain&#x20;(S&#x2F;D)&#x20;formation&#x20;and&#x20;gate&#x20;stack&#x20;engineering&#x20;are&#x20;introduced&#x20;for&#x20;satisfying&#x20;the&#x20;device&#x20;requirements.&#x20;The&#x20;plasma&#x20;post&#x20;oxidation&#x20;to&#x20;form&#x20;GeOx&#x20;interfacial&#x20;layers&#x20;is&#x20;a&#x20;key&#x20;gate&#x20;stack&#x20;technology&#x20;for&#x20;Ge&#x20;CMOS.&#x20;Also,&#x20;direct&#x20;wafer&#x20;bonding&#x20;of&#x20;ultrathin&#x20;body&#x20;quantum&#x20;well&#x20;III-V-OI&#x20;channels,&#x20;combined&#x20;with&#x20;Tri-gate&#x20;structures,&#x20;realizes&#x20;high&#x20;performance&#x20;III-V&#x20;n-MOSFETs&#x20;on&#x20;Si.&#x20;We&#x20;also&#x20;demonstrate&#x20;planar-type&#x20;InGaAs&#x20;and&#x20;Ge&#x2F;strained&#x20;SOI&#x20;TFETs.&#x20;The&#x20;defect-less&#x20;p(+)-n&#x20;source&#x20;junction&#x20;formation&#x20;with&#x20;steep&#x20;impurity&#x20;profiles&#x20;is&#x20;a&#x20;key&#x20;for&#x20;high&#x20;performance&#x20;TFET&#x20;operation.&#x20;(C)&#x20;2016&#x20;Elsevier&#x20;Ltd.&#x20;All&#x20;rights&#x20;reserved.</dcvalue>
<dcvalue element="language" qualifier="none">English</dcvalue>
<dcvalue element="publisher" qualifier="none">PERGAMON-ELSEVIER&#x20;SCIENCE&#x20;LTD</dcvalue>
<dcvalue element="subject" qualifier="none">FIELD-EFFECT-TRANSISTORS</dcvalue>
<dcvalue element="subject" qualifier="none">SELECTIVE-AREA&#x20;GROWTH</dcvalue>
<dcvalue element="subject" qualifier="none">N-MOSFETS</dcvalue>
<dcvalue element="subject" qualifier="none">HIGH-MOBILITY</dcvalue>
<dcvalue element="subject" qualifier="none">GATE-STACKS</dcvalue>
<dcvalue element="subject" qualifier="none">ELECTRICAL-PROPERTIES</dcvalue>
<dcvalue element="subject" qualifier="none">SURFACE&#x20;PASSIVATION</dcvalue>
<dcvalue element="subject" qualifier="none">CARRIER-TRANSPORT</dcvalue>
<dcvalue element="subject" qualifier="none">INTERFACE&#x20;TRAPS</dcvalue>
<dcvalue element="subject" qualifier="none">P-FETS</dcvalue>
<dcvalue element="title" qualifier="none">III-V&#x2F;Ge&#x20;MOS&#x20;device&#x20;technologies&#x20;for&#x20;low&#x20;power&#x20;integrated&#x20;systems</dcvalue>
<dcvalue element="type" qualifier="none">Article</dcvalue>
<dcvalue element="identifier" qualifier="doi">10.1016&#x2F;j.sse.2016.07.002</dcvalue>
<dcvalue element="description" qualifier="journalClass">1</dcvalue>
<dcvalue element="identifier" qualifier="bibliographicCitation">SOLID-STATE&#x20;ELECTRONICS,&#x20;v.125,&#x20;pp.82&#x20;-&#x20;102</dcvalue>
<dcvalue element="citation" qualifier="title">SOLID-STATE&#x20;ELECTRONICS</dcvalue>
<dcvalue element="citation" qualifier="volume">125</dcvalue>
<dcvalue element="citation" qualifier="startPage">82</dcvalue>
<dcvalue element="citation" qualifier="endPage">102</dcvalue>
<dcvalue element="description" qualifier="journalRegisteredClass">scie</dcvalue>
<dcvalue element="description" qualifier="journalRegisteredClass">scopus</dcvalue>
<dcvalue element="identifier" qualifier="wosid">000386231700009</dcvalue>
<dcvalue element="identifier" qualifier="scopusid">2-s2.0-84979499894</dcvalue>
<dcvalue element="relation" qualifier="journalWebOfScienceCategory">Engineering,&#x20;Electrical&#x20;&amp;&#x20;Electronic</dcvalue>
<dcvalue element="relation" qualifier="journalWebOfScienceCategory">Physics,&#x20;Applied</dcvalue>
<dcvalue element="relation" qualifier="journalWebOfScienceCategory">Physics,&#x20;Condensed&#x20;Matter</dcvalue>
<dcvalue element="relation" qualifier="journalResearchArea">Engineering</dcvalue>
<dcvalue element="relation" qualifier="journalResearchArea">Physics</dcvalue>
<dcvalue element="type" qualifier="docType">Article</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">FIELD-EFFECT-TRANSISTORS</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">SELECTIVE-AREA&#x20;GROWTH</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">N-MOSFETS</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">HIGH-MOBILITY</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">GATE-STACKS</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">ELECTRICAL-PROPERTIES</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">SURFACE&#x20;PASSIVATION</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">CARRIER-TRANSPORT</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">INTERFACE&#x20;TRAPS</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">P-FETS</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">MOSFET</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">Tunneling&#x20;FET</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">Germanium</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">III-V&#x20;semiconductors</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">Metal-Oxide-Semiconductor</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">Mobility</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">Interface&#x20;states</dcvalue>
</dublin_core>
