Kim, Youngrok Yoo, Daekyoung Jang, Jingon Song, Younggul Jeong, Hyunhak Cho, Kyungjune Hwang, Wang-Taek Lee, Woocheol Kim, Tae-Wook Lee, Takhee 2024-01-20T04:03:03Z 2024-01-20T04:03:03Z 2021-09-05 2016-06 1566-1199 https://pubs.kist.re.kr/handle/201004/124009 In this study, we fabricated nonvolatile organic memory devices using a mixture of polyimide (PI) and 6-phenyl-C61 butyric acid methyl ester (PCBM) (denoted as PI: PCBM) as an active memory material with Al/PI: PCBM/Al structure. Upon increasing the temperature from room temperature to 470 K, we demonstrated the good nonvolatile memory properties of our devices in terms of the distribution of ON and OFF state currents, the threshold voltage from OFF state to ON state transition, the retention, and the endurance. Our organic memory devices exhibited an excellent ON/OFF ratio (I-ON/I-OFF > 10(3)) through more than 200 ON/OFF switching cycles and maintained ON/OFF states for longer than 10(4) s without showing any serious degradation under measurement temperatures up to 470 K. We also confirmed the structural robustness under thermal stress through transmission electron microscopy cross-sectional images of the active layer after a retention test at 470 K for 10(4) s. This study demonstrates that the operation of PI: PCBM organic memory devices could be controlled at high temperatures and that the structure of our memory devices was maintained during thermal stress. These results may enable the use of nonvolatile organic memory devices in high temperature environments. (C) 2016 Elsevier B.V. All rights reserved. English ELSEVIER SCIENCE BV POLYMER THIN-FILM POLY(METHYL METHACRYLATE) CARBON NANOTUBES DEGRADATION INTEGRATION POLYSTYRENE TRANSISTORS CELLS Characterization of PI:PCBM organic nonvolatile resistive memory devices under thermal stress Article 10.1016/j.orgel.2016.03.008 1 ORGANIC ELECTRONICS, v.33, pp.48 - 54 ORGANIC ELECTRONICS 33 48 54 scie scopus 000375111700007 2-s2.0-84964334620 Materials Science, Multidisciplinary Physics, Applied Materials Science Physics Article POLYMER THIN-FILM POLY(METHYL METHACRYLATE) CARBON NANOTUBES DEGRADATION INTEGRATION POLYSTYRENE TRANSISTORS CELLS Organic memory Nonvolatile memory PI:PCBM Thermal stress Robustness