Rho, Hokyun Lee, Seungmin Bae, Sukang Kim, Tae-Wook Lee, Dong Su Lee, Hyun Jung Hwang, Jun Yeon Jeong, Tak Kim, Sungmin Ha, Jun-Seok Lee, Sang Hyun 2024-01-20T06:31:38Z 2024-01-20T06:31:38Z 2021-09-04 2015-08-03 2045-2322 https://pubs.kist.re.kr/handle/201004/125139 Porous materials have historically been of interest for a wide range of applications in thermal management, for example, in heat exchangers and thermal barriers. Rapid progress in electronic and optoelectronic technology necessitates more efficient spreading and dissipation of the heat generated in these devices, calling for the development of new thermal management materials. Here, we report an effective technique for the synthesis of porous Cu-graphene heterostructures with pores of about 30 mu m and a porosity of 35%. Graphene layers were grown on the surfaces of porous Cu, which was formed via the coalescence of molten Cu microparticles. The surface passivation with graphene layers resulted in a thermal conductivity higher than that of porous Cu, especially at high temperatures (approximately 40% at 1173 K). The improved heat dissipation properties of the porous structures were demonstrated by analysis of the thermal resistance and temperature distribution of LED chips mounted on the structures. The effective combination of the structural and material properties of porous Cu-graphene heterostructures provides a new material for effective thermal management of high-power electronic and optoelectronic devices. English NATURE PUBLISHING GROUP LIGHT-EMITTING-DIODES THERMAL-PROPERTIES CONDUCTIVITY MANAGEMENT Three-Dimensional Porous Copper-Graphene Heterostructures with Durability and High Heat Dissipation Performance Article 10.1038/srep12710 1 SCIENTIFIC REPORTS, v.5 SCIENTIFIC REPORTS 5 scie scopus 000358846500001 2-s2.0-84938376637 Multidisciplinary Sciences Science & Technology - Other Topics Article LIGHT-EMITTING-DIODES THERMAL-PROPERTIES CONDUCTIVITY MANAGEMENT Graphene Copper Porous Heat dissipation