Jeong, Myung-Sun Ju, Byeong-Kwon Lee, Jeon-Kook 2024-01-20T07:01:25Z 2024-01-20T07:01:25Z 2021-09-05 2015-06 1533-4880 https://pubs.kist.re.kr/handle/201004/125373 We observed the effects of nickel plating temperatures for controlling the surface morphologies of the deposited nickel layers on the alumina nano-pores. The alumina nano-channels were filled with nickel at various processing temperatures of 60 similar to 90 degrees C. The electrical properties of the alumina film capacitors were changed with processing temperatures. The electroless nickel plating (ENP) at 60 degrees C improved the nickel penetration into the alumina nano-channels due to the reduced reaction rate. Nickel layers are uniformly formed on the high aspect ratio alumina pores. Due to the uniform nickel electrode, the capacitance density of the alumina film capacitors is improved by the low leakage current, dissipation factor and equivalent series resistance. Alumina film capacitors made by ENP at 60 degrees C had a high capacitance density of 160 nF/cm(2). English AMER SCIENTIFIC PUBLISHERS POLYETHYLENE-GLYCOL COPPER Effects of Processing Temperatures of Nickel Plating on Capacitance Density of Alumina Film Capacitor Article 10.1166/jnn.2015.9781 1 JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.15, no.6, pp.4530 - 4533 JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY 15 6 4530 4533 scie scopus 000347435300070 2-s2.0-84920696881 Chemistry, Multidisciplinary Nanoscience & Nanotechnology Materials Science, Multidisciplinary Physics, Applied Physics, Condensed Matter Chemistry Science & Technology - Other Topics Materials Science Physics Article POLYETHYLENE-GLYCOL COPPER Alumina Film Capacitor Electroless Plating Alumina Nano-Channel Nickel Electrode Processing Temperature