Cui, Yinhua Kim, Areum Lee, Seonjea Choi, Eunmi Yoon, Sung Pil Pyo, Sung Gyu 2024-01-20T08:30:45Z 2024-01-20T08:30:45Z 2021-09-02 2014-12 1533-4880 https://pubs.kist.re.kr/handle/201004/126080 Promoting and employing photovoltaic power as an alternative energy source, the solar cell industry has made rapid strides. However, improving the efficiency of these solar cells using low-cost fabrication processes is still needed. The interface between the Si surface and the electrode plays a very important role in the process of electrode formation of the solar cell. In this study, the electrode interface underwent four different pre-treatments in order to enhance the efficiency of Si-based solar cells. We analyzed the adhesion properties at the interface between the Si wafer and the electrode and conducted an analysis of the variation in contact resistance between the two contact surfaces. To reduce the cost of the entire experiment, we replaced the existing Ag screen printing-based electrode fabrication method with a low-temperature, low-cost Ni/Cu electroless plating method. The test cells exhibited improved adhesion and therefore improved efficiency as compared to cells treated with the currently used diluted HF. English AMER SCIENTIFIC PUBLISHERS ATOMIC-FORCE MICROSCOPY NI/CU CONTACT COPPER RESISTANCE SILICIDE LAYER FILMS ANGLE Interface Modification in Solar Cell Contact Electrode Using Pre-Cleaning Treatment Chemistries Article 10.1166/jnn.2014.10135 1 JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.14, no.12, pp.9401 - 9405 JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY 14 12 9401 9405 scie scopus 000344126900094 2-s2.0-84910645607 Chemistry, Multidisciplinary Nanoscience & Nanotechnology Materials Science, Multidisciplinary Physics, Applied Physics, Condensed Matter Chemistry Science & Technology - Other Topics Materials Science Physics Article ATOMIC-FORCE MICROSCOPY NI/CU CONTACT COPPER RESISTANCE SILICIDE LAYER FILMS ANGLE Solar Electrode Ni/Cu Plating Electroless Plating