Yu, Seunggun Lee, Jang-Woo Han, Tae Hee Park, Cheolmin Kwon, Youngdon Hong, Soon Man Koo, Chong Min 2024-01-20T11:02:56Z 2024-01-20T11:02:56Z 2021-09-05 2013-11-27 1944-8244 https://pubs.kist.re.kr/handle/201004/127427 Thermal management of polymeric composites is a crucial issue to determine the performance and reliability of the devices. Here, we report a straightforward route to prepare polymeric composites with Cu thin film networks. Taking advantage of the fluidity of polymer melt and the ductile properties of Cu films, the polymeric composites were created by the Cu metallization of PS bead and the hot press molding of Cu-plated PS beads. The unique three-dimensional Cu shell-networks in the PS matrix demonstrated isotropic and ideal conductive performance at even extremely low Cu contents. In contrast to the conventional simple melt-mixed Cu beads/PS composites at the same concentration of 23.0 vol %, the PS composites with Cu shell networks indeed revealed 60 times larger thermal conductivity and 8 orders of magnitude larger electrical conductivity. Our strategy offers a straightforward and high-throughput route for the isotropic thermal and electrical conductive composites. English American Chemical Society HEXAGONAL BORON-NITRIDE POLYIMIDE FILMS NANOCOMPOSITES PERCOLATION GRAPHENE DIFFUSIVITY HYBRID SILVER Copper Shell Networks in Polymer Composites for Efficient Thermal Conduction Article 10.1021/am4030406 1 ACS Applied Materials & Interfaces, v.5, no.22, pp.11618 - 11622 ACS Applied Materials & Interfaces 5 22 11618 11622 scie scopus 000327812300021 2-s2.0-84889264459 Nanoscience & Nanotechnology Materials Science, Multidisciplinary Science & Technology - Other Topics Materials Science Article HEXAGONAL BORON-NITRIDE POLYIMIDE FILMS NANOCOMPOSITES PERCOLATION GRAPHENE DIFFUSIVITY HYBRID SILVER percolation composites electroless plating core-shell thermal conductivity electrical conductivity