Cho, Tae-Shin Choi, Heonjin Kim, Joosun 2024-01-20T12:04:54Z 2024-01-20T12:04:54Z 2021-09-04 2013-06 1533-4880 https://pubs.kist.re.kr/handle/201004/128016 Porous platinum films have been fabricated by reactive sputtering combined with subsequent thermal annealing. Using the SEM, XRD, XPS, and polarization resistance measurement techniques, the nnicrostructural development of the film and its resultant electrochemical properties have been characterized. Pore evolution was understood as a result of the thermal grooving of platinum during annealing process. We demonstrated that crystallization should be followed by agglomeration for the evolution of porous microstructures. Furthermore, reaction sputtering affected the adhesion enhancement between the film and substrate compared to the film deposited by non-reactive sputtering. The polarization resistance of the porous platinum film was five times lower than that of the dense platinum film. At 600 degrees C the resistance of the porous film was 5.67 Omega . cm(2), and that of the dense film was 38 Omega . cm(2). English AMER SCIENTIFIC PUBLISHERS OXIDE FUEL-CELLS CAPILLARY INSTABILITIES ELECTROCHEMICAL SYNTHESIS AGGLOMERATION BEHAVIOR PERFORMANCE BOUNDARY LAYERS AU Fabrication of Porous Noble Metal Thin-Film Electrode by Reactive Magnetron Sputtering Article 10.1166/jnn.2013.6661 1 JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.13, no.6, pp.4265 - 4270 JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY 13 6 4265 4270 scie scopus 000320205400080 2-s2.0-84878727098 Chemistry, Multidisciplinary Nanoscience & Nanotechnology Materials Science, Multidisciplinary Physics, Applied Physics, Condensed Matter Chemistry Science & Technology - Other Topics Materials Science Physics Article OXIDE FUEL-CELLS CAPILLARY INSTABILITIES ELECTROCHEMICAL SYNTHESIS AGGLOMERATION BEHAVIOR PERFORMANCE BOUNDARY LAYERS AU Porous Film Platinum Electrode Electrochemical Cell Sputtering