Lee, Sung Bo Kim, Dong-Ik Hong, Seong-Hyeon Lee, Dong Nyung 2024-01-20T13:05:01Z 2024-01-20T13:05:01Z 2021-09-01 2013-01 1073-5623 https://pubs.kist.re.kr/handle/201004/128523 We have examined the evolution of abnormal grain growth texture with increasing post-deposition annealing temperature in nanocrystalline Cu films (20 nm thick) deposited on an amorphous SiNx (20 nm)/Si substrate. Texture is analyzed by a TEM-based orientation and phase mapping technique based on precession electron diffraction. The as-deposited film, which has an initial grain size of similar to 12 nm in diameter, already shows a signature of abnormal grain growth, exhibiting a bimodal grain size distribution. Texture is analyzed by calculating area fractions of major components. The overall texture of the as-deposited film is identified to be < 110 >, but < 100 > grains occupy the largest fraction in the abnormally grown grain areas, followed by < 111 > grains. After annealing at 398 K, 573 K, and 773 K (125 degrees C, 300 degrees C, and 500 degrees C), the overall texture turns to < 112 >. After annealing at 398 K (125 degrees C), abnormally grown grains have a major < 112 > component. The situation is similar for the film annealed at 573 K (300 degrees C). After annealing at 773 K (500 degrees C), the abnormal grain growth texture evolved into major < 111 >. The < 100 > component found in the abnormal grain growth texture for the as-deposited film is clearly explained by elastic strain energy minimization and the < 111 > component for the as-deposited film and the film annealed at 773 K (500 degrees C) is explained by surface energy minimization. The development of the < 112 > texture obtained after annealing at 398 K and 573 K (125 degrees C and 300 degrees C) is not explained by either elastic strain energy minimization or surface energy minimization. We suggest that it is clarified by assuming that the Cu film system is perfectly elastic-plastic, which is associated with the Taylor factors. DOI: 10.1007/s11661-012-1542-5 (C) The Minerals, Metals & Materials Society and ASM International 2012 English SPRINGER GROWTH ORIENTATION DEPENDENCE DISTRIBUTIONS ENERGY STRAIN Texture Evolution of Abnormal Grains with Post-Deposition Annealing Temperature in Nanocrystalline Cu Thin Films Article 10.1007/s11661-012-1542-5 1 METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v.44A, no.1, pp.152 - 162 METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE 44A 1 152 162 scie scopus 000313718500020 2-s2.0-84871941619 Materials Science, Multidisciplinary Metallurgy & Metallurgical Engineering Materials Science Metallurgy & Metallurgical Engineering Article GROWTH ORIENTATION DEPENDENCE DISTRIBUTIONS ENERGY STRAIN