Lim, Ho Sun Kim, Seung-Nam Lim, Jung Ah Park, Seong-Dae 2024-01-20T14:00:52Z 2024-01-20T14:00:52Z 2021-09-05 2012-10 0959-9428 https://pubs.kist.re.kr/handle/201004/128804 Highly conductive pastes were prepared by thermal sintering of silver particles into a polymer matrix. These electrically conductive pastes are composed of a novolac epoxy resin and a trimodal metallic mixture of micron-sized silver flakes, silver microspheres, and silver nanoparticles and can be cured at relatively low temperatures. Our strategy is to cure the epoxy resins at a higher temperature than the sintering temperature of the silver powders to form a good metallic network of the conductive materials. We found that our epoxy-based conducting pastes had a low volume resistivity and high electrical conductivity of 8.9 x 10(-6) Omega cm and 1.1 x 10 5 S cm(-1), respectively, even at a low curing temperature of 250 degrees C. The resulting high conductivity may be attractive for numerous applications in various optoelectronic devices that require low-temperature processing. English ROYAL SOC CHEMISTRY SILVER NANOPARTICLES FUTURE Low temperature-cured electrically conductive pastes for interconnection on electronic devices Article 10.1039/c2jm33168c 1 JOURNAL OF MATERIALS CHEMISTRY, v.22, no.38, pp.20529 - 20534 JOURNAL OF MATERIALS CHEMISTRY 22 38 20529 20534 scie scopus 000308658600061 2-s2.0-84870425860 Chemistry, Physical Materials Science, Multidisciplinary Chemistry Materials Science Article SILVER NANOPARTICLES FUTURE Silver particel paste low temperature process silver flake epoxy resin