Choi, Min Young Choi, Dong Joo Ahn, Key-One Ro, Insoo Kim, Young-Ho Suh, Sang-Hee 2024-01-20T15:03:38Z 2024-01-20T15:03:38Z 2021-09-05 2012-04 1533-4880 https://pubs.kist.re.kr/handle/201004/129390 We investigated the imidization of a polyimide (PI) and the formation of Cu nanoparticles in a PI film by curinga precursor of PI (polyamic acid (PAA) dissolved in n-methyl-2-pyrrolidinone) in a reducing atmosphere in the rapid thermal annealing (RTA) system. A Cu film was deposited onto the SiO2/Si substrate, and the PAA was spin-coated onto the Cu film. After the PAA reacted with the Cu film, soft-baking was performed to evaporate the solvent. Finally, the PAA was imidized to PI at 450 degrees C by curing in a reducing atmosphere with the RTA. Fourier transform infrared spectroscopy showed that the PAA was successfully imidized by the RTA. X-ray diffraction patterns revealed that Cu nanoparticles formed by RTA curing at 450 degrees C for 5 minutes in a reducing atmosphere, and transmission electron microscopy showed that Cu nanoparticles about 6.5 nm in size were uniformly dispersed in the PI film. Curing by RTA is an attractive method because it takes only a few minutes. English AMER SCIENTIFIC PUBLISHERS METAL-OXIDE NANOPARTICLES POLY(AMIC ACID) POLYAMIC ACID IMIDIZATION SPECTROSCOPY CU NANOCRYSTALS POLYMERS MATRIX Fabrication of Copper Nanoparticles in a Thick Polyimide Film Cured by Rapid Thermal Annealing Article 10.1166/jnn.2012.5588 1 JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.12, no.4, pp.3637 - 3640 JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY 12 4 3637 3640 scie scopus 000305850900136 2-s2.0-84863320487 Chemistry, Multidisciplinary Nanoscience & Nanotechnology Materials Science, Multidisciplinary Physics, Applied Physics, Condensed Matter Chemistry Science & Technology - Other Topics Materials Science Physics Article; Proceedings Paper METAL-OXIDE NANOPARTICLES POLY(AMIC ACID) POLYAMIC ACID IMIDIZATION SPECTROSCOPY CU NANOCRYSTALS POLYMERS MATRIX Cu Nanoparticles Polyimide Curing RTA