<?xml version="1.0" encoding="utf-8" standalone="no"?>
<dublin_core schema="dc">
<dcvalue element="contributor" qualifier="author">Lu,&#x20;Wei</dcvalue>
<dcvalue element="contributor" qualifier="author">Jeong,&#x20;Doo&#x20;Seok</dcvalue>
<dcvalue element="contributor" qualifier="author">Kozicki,&#x20;Michael</dcvalue>
<dcvalue element="contributor" qualifier="author">Waser,&#x20;Rainer</dcvalue>
<dcvalue element="date" qualifier="accessioned">2024-01-20T15:32:33Z</dcvalue>
<dcvalue element="date" qualifier="available">2024-01-20T15:32:33Z</dcvalue>
<dcvalue element="date" qualifier="created">2021-09-04</dcvalue>
<dcvalue element="date" qualifier="issued">2012-02</dcvalue>
<dcvalue element="identifier" qualifier="issn">0883-7694</dcvalue>
<dcvalue element="identifier" qualifier="uri">https:&#x2F;&#x2F;pubs.kist.re.kr&#x2F;handle&#x2F;201004&#x2F;129605</dcvalue>
<dcvalue element="description" qualifier="abstract">A&#x20;range&#x20;of&#x20;material&#x20;systems&#x20;exist&#x20;in&#x20;which&#x20;nanoscale&#x20;ionic&#x20;transport&#x20;and&#x20;redox&#x20;reactions&#x20;provide&#x20;the&#x20;essential&#x20;mechanisms&#x20;for&#x20;memristive&#x20;switching.&#x20;One&#x20;class&#x20;relies&#x20;on&#x20;mobile&#x20;cations,&#x20;which&#x20;are&#x20;easily&#x20;created&#x20;by&#x20;electrochemical&#x20;oxidation&#x20;of&#x20;the&#x20;corresponding&#x20;electrode&#x20;metal,&#x20;transported&#x20;in&#x20;the&#x20;insulating&#x20;layer,&#x20;and&#x20;reduced&#x20;at&#x20;the&#x20;inert&#x20;counterelectrode.&#x20;These&#x20;devices&#x20;are&#x20;termed&#x20;electrochemical&#x20;metallization&#x20;(ECM)&#x20;memories,&#x20;also&#x20;called&#x20;conductive&#x20;bridge&#x20;random&#x20;access&#x20;memories.&#x20;The&#x20;memristive&#x20;characteristics&#x20;of&#x20;the&#x20;ECM&#x20;cells&#x20;provide&#x20;opportunities&#x20;for&#x20;circuit&#x20;design&#x20;and&#x20;computational&#x20;concepts&#x20;that&#x20;go&#x20;beyond&#x20;those&#x20;in&#x20;traditional&#x20;complementary&#x20;metal&#x20;oxide&#x20;semiconductor&#x20;(CMOS)&#x20;technology.&#x20;Passive&#x20;memory&#x20;arrays&#x20;open&#x20;up&#x20;paths&#x20;toward&#x20;ultradense&#x20;and&#x20;3D&#x20;stackable&#x20;memory&#x20;and&#x20;logic&#x20;gate&#x20;arrays.&#x20;Furthermore,&#x20;the&#x20;multivalued&#x20;conductance&#x20;characteristics&#x20;allow&#x20;for&#x20;potential&#x20;exploitation&#x20;of&#x20;the&#x20;cells&#x20;as&#x20;synapses&#x20;in&#x20;neuromorphic&#x20;circuits&#x20;in&#x20;future&#x20;energy&#x20;efficient&#x20;high-performance&#x20;computer&#x20;architectures.&#x20;Despite&#x20;exciting&#x20;results&#x20;obtained&#x20;in&#x20;recent&#x20;years,&#x20;many&#x20;challenges&#x20;have&#x20;to&#x20;be&#x20;met&#x20;before&#x20;these&#x20;physical&#x20;effects&#x20;can&#x20;be&#x20;turned&#x20;into&#x20;competitive&#x20;industrial&#x20;technology.&#x20;Here,&#x20;we&#x20;briefly&#x20;review&#x20;the&#x20;basic&#x20;working&#x20;principle,&#x20;the&#x20;different&#x20;possible&#x20;and&#x20;potential&#x20;material&#x20;combinations,&#x20;and&#x20;the&#x20;fundamental&#x20;electrochemical&#x20;processes&#x20;in&#x20;ECM&#x20;cells&#x20;and&#x20;their&#x20;implications&#x20;for&#x20;device&#x20;operations.&#x20;The&#x20;prospects&#x20;of&#x20;ECM-based&#x20;resistive&#x20;random&#x20;access&#x20;memory&#x20;as&#x20;an&#x20;emerging&#x20;memory&#x20;technology&#x20;are&#x20;also&#x20;reviewed&#x20;in&#x20;terms&#x20;of&#x20;switching&#x20;speed&#x20;and&#x20;scalability.</dcvalue>
<dcvalue element="language" qualifier="none">English</dcvalue>
<dcvalue element="publisher" qualifier="none">CAMBRIDGE&#x20;UNIV&#x20;PRESS</dcvalue>
<dcvalue element="subject" qualifier="none">NONVOLATILE&#x20;MEMORY</dcvalue>
<dcvalue element="subject" qualifier="none">CROSSBAR&#x20;ARRAYS</dcvalue>
<dcvalue element="subject" qualifier="none">HIGH-DENSITY</dcvalue>
<dcvalue element="subject" qualifier="none">RESISTANCE</dcvalue>
<dcvalue element="subject" qualifier="none">CBRAM</dcvalue>
<dcvalue element="subject" qualifier="none">FILMS</dcvalue>
<dcvalue element="subject" qualifier="none">AG</dcvalue>
<dcvalue element="subject" qualifier="none">PROGRAM</dcvalue>
<dcvalue element="subject" qualifier="none">VOLTAGE</dcvalue>
<dcvalue element="subject" qualifier="none">ELEMENT</dcvalue>
<dcvalue element="title" qualifier="none">Electrochemical&#x20;metallization&#x20;cells-blending&#x20;nanoionics&#x20;into&#x20;nanoelectronics?</dcvalue>
<dcvalue element="type" qualifier="none">Article</dcvalue>
<dcvalue element="identifier" qualifier="doi">10.1557&#x2F;mrs.2012.5</dcvalue>
<dcvalue element="description" qualifier="journalClass">1</dcvalue>
<dcvalue element="identifier" qualifier="bibliographicCitation">MRS&#x20;BULLETIN,&#x20;v.37,&#x20;no.2,&#x20;pp.124&#x20;-&#x20;130</dcvalue>
<dcvalue element="citation" qualifier="title">MRS&#x20;BULLETIN</dcvalue>
<dcvalue element="citation" qualifier="volume">37</dcvalue>
<dcvalue element="citation" qualifier="number">2</dcvalue>
<dcvalue element="citation" qualifier="startPage">124</dcvalue>
<dcvalue element="citation" qualifier="endPage">130</dcvalue>
<dcvalue element="description" qualifier="journalRegisteredClass">scie</dcvalue>
<dcvalue element="description" qualifier="journalRegisteredClass">scopus</dcvalue>
<dcvalue element="identifier" qualifier="wosid">000302470400013</dcvalue>
<dcvalue element="identifier" qualifier="scopusid">2-s2.0-84857324881</dcvalue>
<dcvalue element="relation" qualifier="journalWebOfScienceCategory">Materials&#x20;Science,&#x20;Multidisciplinary</dcvalue>
<dcvalue element="relation" qualifier="journalWebOfScienceCategory">Physics,&#x20;Applied</dcvalue>
<dcvalue element="relation" qualifier="journalResearchArea">Materials&#x20;Science</dcvalue>
<dcvalue element="relation" qualifier="journalResearchArea">Physics</dcvalue>
<dcvalue element="type" qualifier="docType">Article</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">NONVOLATILE&#x20;MEMORY</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">CROSSBAR&#x20;ARRAYS</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">HIGH-DENSITY</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">RESISTANCE</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">CBRAM</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">FILMS</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">AG</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">PROGRAM</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">VOLTAGE</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">ELEMENT</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">filamentary</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">ionic&#x20;conductor</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">memory</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">Nanoscale</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">thin-film</dcvalue>
</dublin_core>
