Nam, Seungwoong Cho, Hyun Woo Kim, Taeho Kim, Daeheum Sung, Bong June Lim, Soonho Kim, Heesuk 2024-01-20T16:34:06Z 2024-01-20T16:34:06Z 2021-09-05 2011-07-25 0003-6951 https://pubs.kist.re.kr/handle/201004/130170 We experimentally and theoretically demonstrated that the addition of silica particles could improve both the electrical conductivity and the thermomechanical properties of epoxy/silver nanocomposites. As silica particles were added, the electrical percolation threshold concentration of silver nanoparticles decreased and the electrical resistivity of the composite decreased by about 8 orders of magnitude. The coefficient of thermal expansion also decreased with increasing volume fraction of silica particles. Molecular simulations showed that the additional silica particles made the effective intermolecular interactions between silver nanoparticles attractive, thereby enhancing the formation of an electrical percolation network. (C) 2011 American Institute of Physics. [doi:10.1063/1.3615690] English AMER INST PHYSICS CONDUCTIVE ADHESIVES FAILURE MECHANISMS FLIP-CHIP RELIABILITY COMPOSITES SIZE RESISTANCE SOLDER Effects of silica particles on the electrical percolation threshold and thermomechanical properties of epoxy/silver nanocomposites Article 10.1063/1.3615690 1 APPLIED PHYSICS LETTERS, v.99, no.4 APPLIED PHYSICS LETTERS 99 4 scie scopus 000293475500059 2-s2.0-79961080129 Physics, Applied Physics Article CONDUCTIVE ADHESIVES FAILURE MECHANISMS FLIP-CHIP RELIABILITY COMPOSITES SIZE RESISTANCE SOLDER