Shin, Jinhyun Vita, Astini Windu, Sari Choi, Jung-Hae Lee, Seung-Cheol Lee, June Gunn 2024-01-20T16:34:54Z 2024-01-20T16:34:54Z 2021-09-05 2011-07 1533-4880 https://pubs.kist.re.kr/handle/201004/130210 Density functional theory calculations were performed on the energetics of an adatom and adlayer of Cu on a Ru(0001) slab and on the interdiffusion of Cu or Ru at the interface of Cu/Ru(0001) slab. The total energy calculations showed the equal possibilities of both pseudomorphic hcp- and fcc-adlayers of Cu on the Ru(0001) slab. The formation energies of mono-vacancy at the Cu/Ru(0001) interface and the barrier energies of the vacancy-mediated interdiffusion were calculated. The formation energies of mono-vacancy at the Cu/Ru(0001) interface were determined to be 1.31 eV for Cu atom and 1.83 eV for Ru atom, respectively. The diffusion of Ru atom into the vacancy of Cu across the Cu/Ru(0001) interface required energy increase of 0.98 eV, and the barrier energy was substantially high, 1.80 eV. On the other hand, the diffusion of Cu atom into the vacancy of Ru across the Ru/Cu(0001) interface was favored with the energy reduction of 0.35 eV. However, under this most favorable situation, the barrier energy is 0.52 eV. The calculation results imply that, as far as energetics is concerned, the diffusion of both Cu and Ru atoms via the vacancy-mediated diffusion mechanism at the Cu/Ru(0001) interface seems rather restricted unless considerable thermal activation is provided. English AMER SCIENTIFIC PUBLISHERS AUGMENTED-WAVE METHOD ENERGY CU DEPOSITION DIFFUSION POINTS METALS FILMS Energetics and Interdiffusion at the Cu/Ru(0001) Interface: Density Functional Calculations Article 10.1166/jnn.2011.4460 1 JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.11, no.7, pp.6589 - 6593 JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY 11 7 6589 6593 scie scopus 000293663200187 2-s2.0-84863057516 Chemistry, Multidisciplinary Nanoscience & Nanotechnology Materials Science, Multidisciplinary Physics, Applied Physics, Condensed Matter Chemistry Science & Technology - Other Topics Materials Science Physics Article AUGMENTED-WAVE METHOD ENERGY CU DEPOSITION DIFFUSION POINTS METALS FILMS Cu/Ru Interface Density Functional Calculations Adsorption Energy Vacancy Formation Energy Diffusion Barrier