Kim, Jaehoon Carbonell, Ruben G. 2024-01-20T19:32:50Z 2024-01-20T19:32:50Z 2021-09-04 2010-04 0959-9428 https://pubs.kist.re.kr/handle/201004/131576 Palladium (Pd) catalyzed copper (Cu) films were produced by forming films of Cu(II) compound (Cu(hfac)(2)center dot H(2)O) and Pd(II) compound (Pd(hfac)(2)) on silicon oxide (SiO(x)) and titanium nitride (TiN) substrates using a Displacement from two Immiscible Supercritical Phases (DISPs) technique followed by reduction of the organometallic compounds films in hydrogen at 200 degrees C. The morphology of Cu films was observed using scanning electron microscopy (SEM) and atomic force microscopy (AFM). In the absence of Pd(hfac)(2), Cu particles in the range of 60-95 nm formed on SiOx or TiN during the 5 min reduction period. As the Pd(hfac)(2) concentration increased to 5 mol% (relative to the amount of Cu(hfac)(2)center dot H(2)O), a morphology transition from particle formation to film formation was observed. When the Cu(hfac)(2)center dot H(2)O concentration varied from 0.1 wt% to 3 wt% at a fixed Pd(hfac)(2) concentration of 5 mol%, highly uniform, dense and adherent films with 10-40 nm in thickness were produced. Root mean square (rms) roughness of these films, estimated by AFM images, is in the range of 1.7-5.8 nm. Chemical composition analysis of 5 mol% Pd catalyzed Cu film by X-ray photoelectron spectroscopy (XPS) revealed that approximately the ratio of Pd to Cu incorporated into the film was two times larger than the initial Pd(hfac)(2) to Cu(hfac)(2)center dot H(2)O ratio. English ROYAL SOC CHEMISTRY CHEMICAL-VAPOR-DEPOSITION CARBON-DIOXIDE SOLUTION IMMERSION DEPOSITION FLUID DEPOSITION NICKEL FILMS METAL-FILMS SILICON METALLIZATION Deposition of palladium catalyzed copper films by the displacement of two immiscible supercritical phases and subsequent reaction Article 10.1039/b925959g 1 JOURNAL OF MATERIALS CHEMISTRY, v.20, no.19, pp.3973 - 3978 JOURNAL OF MATERIALS CHEMISTRY 20 19 3973 3978 scie scopus 000277318100027 2-s2.0-77951921464 Chemistry, Physical Materials Science, Multidisciplinary Chemistry Materials Science Article CHEMICAL-VAPOR-DEPOSITION CARBON-DIOXIDE SOLUTION IMMERSION DEPOSITION FLUID DEPOSITION NICKEL FILMS METAL-FILMS SILICON METALLIZATION