Moon, Myoung-Woon Han, Jun Hyun 2024-01-20T20:30:34Z 2024-01-20T20:30:34Z 2021-09-04 2009-11-15 0169-4332 https://pubs.kist.re.kr/handle/201004/131959 The elastic moduli of ultra thin tungsten (W) films on polymers were assessed with wrinkling analysis. Thin W films with a range of thickness between 17 and 100 nm were deposited on compliant polymers and Si strips using DC magnetron sputtering method, causing the tensile stress in a few GPa scale with respect to the thickness of W films. By applying lateral compression on polymer, wrinkle patterns were developed in the W thin film with well-defined amplitude and wavelength. Using a simple equation on wrinkle analysis, the range of elastic moduli was estimated with increasing the thickness. It was found that the elastic modulus and the tensile stress decreased with increasing the film thickness. (c) 2009 Published by Elsevier B.V. English ELSEVIER SCIENCE BV BUCKLING-BASED METROLOGY COMPRESSED THIN-FILMS FOCUSED ION-BEAM RESIDUAL-STRESS MICROSTRUCTURE ADHESION PATTERNS A measurement of elastic moduli for tungsten films on polymer substrate using wrinkling analysis Article 10.1016/j.apsusc.2009.04.186 1 APPLIED SURFACE SCIENCE, v.256, no.3, pp.593 - 596 APPLIED SURFACE SCIENCE 256 3 593 596 scie scopus 000271757300003 2-s2.0-71749109549 Chemistry, Physical Materials Science, Coatings & Films Physics, Applied Physics, Condensed Matter Chemistry Materials Science Physics Article BUCKLING-BASED METROLOGY COMPRESSED THIN-FILMS FOCUSED ION-BEAM RESIDUAL-STRESS MICROSTRUCTURE ADHESION PATTERNS Wrinkling Tungsten Microstructure DC magnetron sputtering