Bali, R. Fleury, E. Han, S. H. Ahn, J. P. 2024-01-20T23:03:47Z 2024-01-20T23:03:47Z 2021-09-03 2008-06-12 0925-8388 https://pubs.kist.re.kr/handle/201004/133395 The microstructure of Sn96.4Ag2.8Cu0.8 (at.%) solder alloy when rapidly quenched onto an Au surface finish has been found to range from nanometer to micrometer-sized features. This striking microstructure contained a spectrum of phases from the Au-Sn phase diagram, while Ag and Cu did not appear to participate in the solidification process. Within the solder contact, a eutectic with 40 nm interlamellar spacing was observed, along with the presence of layered intermetallics. Observations of these phases and their orientation offer better understanding of the solidification of Pb-free solders onto Au. (C) 2007 Elsevier B.V. All rights reserved. English ELSEVIER SCIENCE SA LEAD-FREE SOLDER FLIP-CHIP MICROSTRUCTURAL EVOLUTION TENSILE PROPERTIES EUTECTIC SNPB ALLOYS TECHNOLOGY CHALLENGES Interfacial intermetallic phases and nanoeutectic in rapidly quenched Sn-Ag-Cu on Au under bump metallization Article 10.1016/j.jallcom.2007.02.129 1 JOURNAL OF ALLOYS AND COMPOUNDS, v.457, no.1-2, pp.113 - 117 JOURNAL OF ALLOYS AND COMPOUNDS 457 1-2 113 117 scie scopus 000256124900025 2-s2.0-42649110729 Chemistry, Physical Materials Science, Multidisciplinary Metallurgy & Metallurgical Engineering Chemistry Materials Science Metallurgy & Metallurgical Engineering Article LEAD-FREE SOLDER FLIP-CHIP MICROSTRUCTURAL EVOLUTION TENSILE PROPERTIES EUTECTIC SNPB ALLOYS TECHNOLOGY CHALLENGES microstructure phase diagram transmission electron microscopy TEM scanning electron microscopy SEM laser processing