Lee, Wook-Jae Kim, Yoon-Bae Jee, Kwang-Ku Lee, Woo-Young 2024-01-20T23:31:05Z 2024-01-20T23:31:05Z 2021-09-03 2008-05 0374-4884 https://pubs.kist.re.kr/handle/201004/133530 In this study, we investigated the adhesion properties of a NiCr(100 angstrom)/Cu(2000 angstrom) metal film on a PI film modified by Ar+O-2 Reactive ion etching (RIE) with various ion doses at an ion beam energy of 250 eV. The result for the contact angles of water indicates that the surface modification by Ar+O-2 RIE considerably decreases the contact angle from 68 degrees to 2 degrees at an ion dose of 1 x 10(18) ions/cm(2), which results in an increase by a factor of two in the surface energy. The XPS spectrum showed that C-O and C=O bonding, identified as functional groups on the modified PI surface, was increased by interaction between scissored unstable chains and reactive ions. As a result, the PI surfaces modified by Ar+O-2 RIE showed significant improvement in adhesion to overcoated metal films. English KOREAN PHYSICAL SOC SURFACE ENERGY IRRADIATION PLASMA Improvement of the adhesion properties between copper and a polyimide film Article 10.3938/jkps.52.1673 1 JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.52, no.5, pp.1673 - 1676 JOURNAL OF THE KOREAN PHYSICAL SOCIETY 52 5 1673 1676 scie scopus kci ART001082781 000255905500081 2-s2.0-44649173670 Physics, Multidisciplinary Physics Article; Proceedings Paper SURFACE ENERGY IRRADIATION PLASMA RIE hydrophilic group tie layer peel strength