Lee, Chang Hwa Kim, Ae Rim Kim, Soo-Kil Koo, Hyo-Chol Cho, Sung Ki Kim, Jae Jeong 2024-01-21T00:02:03Z 2024-01-21T00:02:03Z 2021-09-03 2008-01 1099-0062 https://pubs.kist.re.kr/handle/201004/133837 This paper describes electroless Cu filling of trenches with different widths ranging from 130 to 300 nm, using a concentration-dependent effect of 3-N,N-dimethylaminodithiocarbamoyl-1-propanesulfonic acid (DPS). With a fixed DPS concentration, it is shown that these trenches with different dimensions cannot be superfilled simultaneously. This is presumably caused by different surface concentrations of the adsorbed additive, which depends on the feature size and surface area. A two-step filling method is employed to superfill those trenches, which is also effective in control of the deposited Cu amounts to obtain uniform growth front regardless of the trench dimensions. (C) 2007 The Electrochemical Society. English ELECTROCHEMICAL SOC INC BOTTOM-UP FILL COPPER ELECTRODEPOSITION INTEGRATION MECHANISM GROWTH Two-step filling in Cu electroless deposition using a concentration-dependent effect of 3-N,N-dimethylaminodithiocarbamoyl-1-propanesulfonic acid Article 10.1149/1.2798877 1 ELECTROCHEMICAL AND SOLID STATE LETTERS, v.11, no.1, pp.D18 - D21 ELECTROCHEMICAL AND SOLID STATE LETTERS 11 1 D18 D21 scie scopus 000250983500013 2-s2.0-36148933791 Electrochemistry Materials Science, Multidisciplinary Electrochemistry Materials Science Article BOTTOM-UP FILL COPPER ELECTRODEPOSITION INTEGRATION MECHANISM GROWTH Cu Interconnection Electroless deposition