Wei, Xiaoding Lee, Dongyun Shim, Sanghoon Chen, Xi Kysar, Jeffrey W. 2024-01-21T00:33:13Z 2024-01-21T00:33:13Z 2021-09-02 2007-09 1359-6462 https://pubs.kist.re.kr/handle/201004/134161 Free-standing nanocrystalline Cu films with grain size around 39 mn are fabricated by thermal evaporation and characterized by the plane-strain bulge test. Young's modulus and yield stress at a 0.2% offset are about 110-130 GPa and 400 MPa, respectively. Results show that the strength of the n-Cu films is largely independent of film thickness at a strain rate less than 10(-5) s(-1). No grain growth is observed and the predominant plastic deformation mechanism is grain boundary sliding accompanied by dislocation mechanisms. (c) 2007 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved. English PERGAMON-ELSEVIER SCIENCE LTD GRAIN-SIZE DEPENDENCE MECHANICAL-PROPERTIES PLASTIC-DEFORMATION TENSILE BEHAVIOR RATE SENSITIVITY METALS GROWTH PALLADIUM STRESS STRENGTH Plain-strain bulge test for nanocrystalline copper thin films Article 10.1016/j.scriptamat.2007.05.012 1 SCRIPTA MATERIALIA, v.57, no.6, pp.541 - 544 SCRIPTA MATERIALIA 57 6 541 544 scie scopus 000248638600024 2-s2.0-34447251637 Nanoscience & Nanotechnology Materials Science, Multidisciplinary Metallurgy & Metallurgical Engineering Science & Technology - Other Topics Materials Science Metallurgy & Metallurgical Engineering Article GRAIN-SIZE DEPENDENCE MECHANICAL-PROPERTIES PLASTIC-DEFORMATION TENSILE BEHAVIOR RATE SENSITIVITY METALS GROWTH PALLADIUM STRESS STRENGTH nanocrystalline materials thin films bulge test