<?xml version="1.0" encoding="utf-8" standalone="no"?>
<dublin_core schema="dc">
<dcvalue element="contributor" qualifier="author">Lee,&#x20;H.&#x20;-W.</dcvalue>
<dcvalue element="contributor" qualifier="author">Kim,&#x20;J.</dcvalue>
<dcvalue element="contributor" qualifier="author">Lee,&#x20;J.&#x20;-H.</dcvalue>
<dcvalue element="contributor" qualifier="author">Song,&#x20;H.</dcvalue>
<dcvalue element="date" qualifier="accessioned">2024-01-21T02:34:55Z</dcvalue>
<dcvalue element="date" qualifier="available">2024-01-21T02:34:55Z</dcvalue>
<dcvalue element="date" qualifier="created">2021-09-02</dcvalue>
<dcvalue element="date" qualifier="issued">2006-08</dcvalue>
<dcvalue element="identifier" qualifier="issn">1013-9826</dcvalue>
<dcvalue element="identifier" qualifier="uri">https:&#x2F;&#x2F;pubs.kist.re.kr&#x2F;handle&#x2F;201004&#x2F;135279</dcvalue>
<dcvalue element="description" qualifier="abstract">Thermoset&#x20;molding&#x20;in&#x20;wet&#x20;and&#x20;dry&#x20;state&#x20;was&#x20;successfully&#x20;employed&#x20;to&#x20;fabricate&#x20;high&#x20;strength&#x20;reaction&#x20;bonded&#x20;silicon&#x20;carbide&#x20;(RBSC)&#x20;ceramics.&#x20;Granule&#x20;transfer&#x20;molding&#x20;(GCM)&#x20;was&#x20;developed&#x20;to&#x20;prevent&#x20;segregation&#x20;of&#x20;component&#x20;particles&#x20;and&#x20;binder&#x20;phase&#x20;in&#x20;wet&#x20;state,&#x20;while&#x20;granule&#x20;compression&#x20;molding&#x20;was&#x20;applied&#x20;in&#x20;dry&#x20;state&#x20;to&#x20;fabricate&#x20;green&#x20;compact&#x20;with&#x20;significant&#x20;variation&#x20;of&#x20;compaction&#x20;ratio.&#x20;Low-fill&#x20;density&#x20;granules&#x20;with&#x20;mixing&#x20;homogeneity&#x20;were&#x20;critical&#x20;for&#x20;promoting&#x20;lateral&#x20;deformation&#x20;of&#x20;granules&#x20;during&#x20;consolidation.&#x20;In&#x20;addition,&#x20;anodic&#x20;performance&#x20;of&#x20;Ni-YSZ&#x20;anode&#x20;was&#x20;significantly&#x20;enhanced&#x20;by&#x20;replacing&#x20;solid&#x20;fugitive&#x20;phase&#x20;with&#x20;viscoelastic&#x20;fugitive&#x20;phase&#x20;used&#x20;as&#x20;binder&#x20;in&#x20;thermoset&#x20;molding.</dcvalue>
<dcvalue element="language" qualifier="none">English</dcvalue>
<dcvalue element="publisher" qualifier="none">TRANS&#x20;TECH&#x20;PUBLICATIONS&#x20;LTD</dcvalue>
<dcvalue element="subject" qualifier="none">SILICON-CARBIDE</dcvalue>
<dcvalue element="subject" qualifier="none">ANODE</dcvalue>
<dcvalue element="subject" qualifier="none">SOFC</dcvalue>
<dcvalue element="title" qualifier="none">Fabrication&#x20;of&#x20;large&#x20;ceramic&#x20;components&#x20;with&#x20;controlled&#x20;microstructure&#x20;by&#x20;powder&#x20;thermoset&#x20;molding</dcvalue>
<dcvalue element="type" qualifier="none">Article</dcvalue>
<dcvalue element="identifier" qualifier="doi">10.4028&#x2F;www.scientific.net&#x2F;KEM.317-318.733</dcvalue>
<dcvalue element="description" qualifier="journalClass">1</dcvalue>
<dcvalue element="identifier" qualifier="bibliographicCitation">SCIENCE&#x20;OF&#x20;ENGINEERING&#x20;CERAMICS&#x20;III,&#x20;v.317-318,&#x20;pp.733&#x20;-&#x20;738</dcvalue>
<dcvalue element="citation" qualifier="title">SCIENCE&#x20;OF&#x20;ENGINEERING&#x20;CERAMICS&#x20;III</dcvalue>
<dcvalue element="citation" qualifier="volume">317-318</dcvalue>
<dcvalue element="citation" qualifier="startPage">733</dcvalue>
<dcvalue element="citation" qualifier="endPage">738</dcvalue>
<dcvalue element="description" qualifier="journalRegisteredClass">scie</dcvalue>
<dcvalue element="description" qualifier="journalRegisteredClass">scopus</dcvalue>
<dcvalue element="identifier" qualifier="wosid">000240097700172</dcvalue>
<dcvalue element="identifier" qualifier="scopusid">2-s2.0-33746087964</dcvalue>
<dcvalue element="relation" qualifier="journalWebOfScienceCategory">Materials&#x20;Science,&#x20;Ceramics</dcvalue>
<dcvalue element="relation" qualifier="journalWebOfScienceCategory">Materials&#x20;Science,&#x20;Composites</dcvalue>
<dcvalue element="relation" qualifier="journalResearchArea">Materials&#x20;Science</dcvalue>
<dcvalue element="type" qualifier="docType">Article;&#x20;Proceedings&#x20;Paper</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">SILICON-CARBIDE</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">ANODE</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">SOFC</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">thermoset&#x20;molding</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">transfer&#x20;molding</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">compression&#x20;molding</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">reaction&#x20;bonded&#x20;silicon&#x20;carbide</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">Ni-YSZ&#x20;anode</dcvalue>
</dublin_core>
