신지영 손영석 이대영 2024-01-21T03:02:51Z 2024-01-21T03:02:51Z 2021-10-21 2006-06 1229-6422 https://pubs.kist.re.kr/handle/201004/135454 Rapid development of electronic technology requires small size, high density packaging and high power in the electronic devices, which results in more heat generation. Suitable heat dissipation is required to ensure the guaranteed performance and reliable operation of the current state-of-the-art electronic equipment. The aim of the present study is to find out the forced-convective thermal-hydraulic characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices through the analysis and experiment. Various configuration of the pin-fin array is selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer and pressure drop characteristics. Experimental results are compared with the analyses and correlations of several researchers. Finally, the design guide are provided for the required pressure drop and/or the heat transfer characteristics of the heat exchanger. 대한설비공학회 열전달 및 압력강하 특성을 고려한 채널 내 핀-휜 구조물의 설계 Design of a Pin-Fin Structure in a Channel Considering the Heat Transfer and Pressure Drop Characteristics Article 2 설비공학 논문집, v.18, no.6, pp.459 - 467 설비공학 논문집 18 6 459 467 kci ART001101188 Electronic device(전자장비) Cooling technology(냉각기술) Pin-fin array(핀-휜 배열) Porosity(다공도) Design guide(설계지침)