Lee, Joong Kee Jeon, Bup Ju Lee, Sangwha 2024-01-21T03:33:13Z 2024-01-21T03:33:13Z 2022-01-11 2006-03 0255-5476 https://pubs.kist.re.kr/handle/201004/135666 Cu/C:H films were prepared on the PET (polyethylene terephthalate) substrate under room temperature by ECR (electron-cyclotron-resonance) chemical vapor deposition coupled with a (-)DC bias system. Hydrogen contents in the plasma strongly affected the crystallographic structures, sheet resistivity, and the composition of deposited films. Cu (111) peaks by XRD analysis were clearly observed with the increase of hydrogen contents. The surface morphology also indicated that copper grains of very fine crystallites were incorporated in the metal-organic composite films by the introduction of hydrogen gas to the plasma. Cu/C:H composite films exhibited a good adhesion force due to the generation of sp(3)-CH2 bonding. These observations imply that hydrogen induced the formation of stable volatile organic compounds and the reduction of copper, consequently leading to a significant alteration of the crystallographic structure and composition of deposited films. Finally, the EMI shielding efficiency was increased by the addition of hydrogen gas to the plasma, probably due to the increase of copper contents in the film. English TRANS TECH PUBLICATIONS LTD Effect of hydrogen content on characteristics of Cu/C : H films coated on polyethylene terephthalate substrate prepared by ECR-MOCVD coupled with a periodic DC bias Article 10.4028/www.scientific.net/MSF.510-511.666 1 ECO-MATERIALS PROCESSING & DESIGN VII, v.510-511, pp.666 - 669 ECO-MATERIALS PROCESSING & DESIGN VII 510-511 666 669 scie scopus 000237176000167 2-s2.0-35848969819 Engineering, Manufacturing Materials Science, Multidisciplinary Engineering Materials Science Article; Proceedings Paper ECR DC bias Cu/C : H film room temperature CVD PET EMI (electromagnetic interference)