Lee, S. H. Jung, H. Y. Doh, J. M. Yoon, J. K. Lim, H. N. 2024-01-21T03:35:32Z 2024-01-21T03:35:32Z 2021-09-02 2006-03 0255-5476 https://pubs.kist.re.kr/handle/201004/135714 Effects of 0.5 wt% Indium addition on the oxidation of Au-Pt-Cu alloy, the interfacial microstructure and bonding strength between porcelain and Au-Pt-Cu-xIn alloys(x = 0, 0.5wt%) were investigated using scanning electron microscopy, X-ray diffractometry, transmission electron microscopy, and a tensile tester. The bonding strength of the Au-Pt-Cu and Au-Pt-Cu-0.5In alloys with porcelain was about 24.6 MPa and 49.5 MPa in average, respectively. This higher bonding strength in the Au-Pt-Cu-0.5In alloy compared with the Au-Pt-Cu alloy without In is ascribed to the formation of In2O3 at the interface between porcelain and Au-Pt-Cu-0.5In alloy. Especially, the formation of In2O3 at the interface between porcelain and Au-Pt-Cu-0.5In alloy leads to enhancing chemical bonding. between In2O3 and various oxides in porcelain, and also to improving the anchoring effect. English TRANS TECH PUBLICATIONS LTD Effect of indium on bonding between porcelain and Au-Pt-Cu alloy Article 10.4028/www.scientific.net/MSF.510-511.282 1 ECO-MATERIALS PROCESSING & DESIGN VII, v.510-511, pp.282 - 285 ECO-MATERIALS PROCESSING & DESIGN VII 510-511 282 285 scie scopus 000237176000071 2-s2.0-35748941996 Engineering, Manufacturing Materials Science, Multidisciplinary Engineering Materials Science Article; Proceedings Paper Au-Pt-Cu alloy porcelain In2O3 oxide bonding strength interfacial microstructure