Choi, YJ Park, JH Ko, WJ Hwang, IS Park, JH Park, JG Nahm, S 2024-01-21T03:39:48Z 2024-01-21T03:39:48Z 2021-09-02 2006-02 0002-7820 https://pubs.kist.re.kr/handle/201004/135790 Co-firing and shrinkage matching of low- and middle- permittivity dielectric compositions for the application to a low-temperature co-fired ceramics system was investigated. Several glass compositions were initially examined for the low-temperature firing of middle-K (K similar to 20) dielectrics, and their compositions were further modified for shrinkage matching between low-K (K similar to 6) and middle-K layers. By controlling the processing parameters such as the solid loading ratio and stacking sequence, the warpages between hetero-layers could be minimized. English WILEY GLASS ADDITIONS MICROSTRUCTURE Co-firing and shrinkage matching in low- and middle- permittivity dielectric compositions for a low-temperature co-fired ceramics system Article 10.1111/j.1551-2916.2005.00748.x 1 JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v.89, no.2, pp.562 - 567 JOURNAL OF THE AMERICAN CERAMIC SOCIETY 89 2 562 567 scie scopus 000234740600026 2-s2.0-33645123674 Materials Science, Ceramics Materials Science Article GLASS ADDITIONS MICROSTRUCTURE LTCC glass dielectric ceramics