명종윤 전법주 변동진 이중기 2024-01-21T04:39:26Z 2024-01-21T04:39:26Z 2021-09-06 2005-07 1225-0562 https://pubs.kist.re.kr/handle/201004/136304 Preparation of copper film on PET substrate was carried out by cyclic operation of RF-magnetron-sputtering under continuous operation of ECR-CVD. The purpose of this study is aimed to an increase in deposition rate with keeping excellent adhesion between copper film and PET. In order to optimize the sputtering time under continuous ECR-CVD, cyclic operation concept is employed. By changing parameters of cyclic operation such as split of θ and cycle time of λ, the characteristics and thickness of the deposited copper film are controlled. As θ value increase, film thickness could confirm to increase and its surface resistivity value decreases. The highest adhesive strength appears at θ = 0.33 and cycle time of 30min. The uniformity of copper film shows 5% in our experimental range. 한국재료학회 연속 ECR-CVD 조업하에 RF-magnetron-sputter의 싸이클조업을 통해 PET위에 올려진 구리박막의 특성 Characteristic of copper films on PET substrate deposited by cyclic operation of RF-magnetron-sputtering coupled with continuous operation of ECR-CVD Article 2 한국재료학회지, v.15, no.7, pp.465 - 472 한국재료학회지 15 7 465 472 N kci ART000967292 Cyclic operation ECR-CVD RF magnetron sputter Copper film Cyclic operation ECR-CVD RF magnetron sputter Copper film