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<dublin_core schema="dc">
<dcvalue element="contributor" qualifier="author">Park,&#x20;JH</dcvalue>
<dcvalue element="contributor" qualifier="author">Son,&#x20;JH</dcvalue>
<dcvalue element="contributor" qualifier="author">Yoon,&#x20;DS</dcvalue>
<dcvalue element="contributor" qualifier="author">Kim,&#x20;TS</dcvalue>
<dcvalue element="contributor" qualifier="author">Park,&#x20;HH</dcvalue>
<dcvalue element="contributor" qualifier="author">Kim,&#x20;H</dcvalue>
<dcvalue element="date" qualifier="accessioned">2024-01-21T05:10:12Z</dcvalue>
<dcvalue element="date" qualifier="available">2024-01-21T05:10:12Z</dcvalue>
<dcvalue element="date" qualifier="created">2021-09-05</dcvalue>
<dcvalue element="date" qualifier="issued">2005-04</dcvalue>
<dcvalue element="identifier" qualifier="issn">1058-4587</dcvalue>
<dcvalue element="identifier" qualifier="uri">https:&#x2F;&#x2F;pubs.kist.re.kr&#x2F;handle&#x2F;201004&#x2F;136584</dcvalue>
<dcvalue element="description" qualifier="abstract">Much&#x20;attention&#x20;has&#x20;been&#x20;paid&#x20;to&#x20;PZT&#x20;thick&#x20;films&#x20;on&#x20;Si-based&#x20;substrate&#x20;since&#x20;they&#x20;began&#x20;to&#x20;be&#x20;used&#x20;as&#x20;piezoelectric&#x20;actuators&#x20;and&#x20;sensors&#x20;with&#x20;introduction&#x20;of&#x20;MEMS&#x20;technology&#x20;and&#x20;screen&#x20;printing&#x20;method.&#x20;However,&#x20;the&#x20;thick&#x20;films&#x20;made&#x20;just&#x20;by&#x20;screen&#x20;printing&#x20;method&#x20;have&#x20;high&#x20;porosity&#x20;as&#x20;compared&#x20;with&#x20;bulk&#x20;product,&#x20;and&#x20;the&#x20;PZT&#x20;thick&#x20;films&#x20;on&#x20;Si-based&#x20;substrate&#x20;have&#x20;problems&#x20;regarding&#x20;degradation&#x20;of&#x20;active&#x20;materials&#x20;and&#x20;interface&#x20;properties&#x20;owing&#x20;to&#x20;inter-diffusion&#x20;or&#x20;reaction&#x20;between&#x20;Si&#x20;substrate&#x20;and&#x20;PZT&#x20;materials&#x20;at&#x20;high&#x20;temperature&#x20;for&#x20;sintering.&#x20;Thus&#x20;we&#x20;have&#x20;fabricated&#x20;screen&#x20;printed&#x20;PZT&#x20;thick&#x20;films&#x20;on&#x20;Si&#x20;substrate&#x20;using&#x20;screen&#x20;printing&#x20;method&#x20;and&#x20;sol&#x20;infiltration&#x20;for&#x20;enhancing&#x20;densification.&#x20;New&#x20;ethanol&#x20;based&#x20;photo-sensitive&#x20;(self-pattern-able)&#x20;sol&#x20;and&#x20;conventional&#x20;diol&#x20;based&#x20;sol&#x20;were&#x20;used&#x20;in&#x20;order&#x20;to&#x20;compare&#x20;influence&#x20;of&#x20;patterning&#x20;process&#x20;and&#x20;investigate&#x20;adoptability&#x20;in&#x20;device&#x20;process&#x20;for&#x20;biochip.&#x20;Thick&#x20;films&#x20;with&#x20;relative&#x20;high&#x20;densities&#x20;at&#x20;low&#x20;temperature,&#x20;800degreesC&#x20;and&#x20;without&#x20;inter-diffusion&#x20;and&#x20;reaction&#x20;between&#x20;the&#x20;layers&#x20;and&#x20;thick&#x20;film&#x20;were&#x20;accomplished.&#x20;And&#x20;it&#x20;was&#x20;revealed&#x20;that&#x20;the&#x20;PZT&#x20;thick&#x20;film&#x20;treated&#x20;by&#x20;ethanol&#x20;based&#x20;self&#x20;pattem-able&#x20;sol&#x20;showed&#x20;better&#x20;electrical&#x20;properties&#x20;as&#x20;well&#x20;as&#x20;better&#x20;pattern-ability,&#x20;and&#x20;consequently&#x20;it&#x20;was&#x20;applicable&#x20;to&#x20;cantilever&#x20;based&#x20;biochip&#x20;without&#x20;additional&#x20;PZT&#x20;film&#x20;patterning&#x20;process.</dcvalue>
<dcvalue element="language" qualifier="none">English</dcvalue>
<dcvalue element="publisher" qualifier="none">TAYLOR&#x20;&amp;&#x20;FRANCIS&#x20;LTD</dcvalue>
<dcvalue element="subject" qualifier="none">SILICON</dcvalue>
<dcvalue element="title" qualifier="none">Electrical&#x20;properties&#x20;of&#x20;screen&#x20;printed&#x20;PZT&#x20;thick&#x20;films&#x20;infiltrated&#x20;with&#x20;photo-sensitive&#x20;sol&#x20;compared&#x20;with&#x20;normal&#x20;sol&#x20;for&#x20;cantilever&#x20;type&#x20;biochip</dcvalue>
<dcvalue element="type" qualifier="none">Article</dcvalue>
<dcvalue element="identifier" qualifier="doi">10.1080&#x2F;10584580590898613</dcvalue>
<dcvalue element="description" qualifier="journalClass">1</dcvalue>
<dcvalue element="identifier" qualifier="bibliographicCitation">INTEGRATED&#x20;FERROELECTRICS,&#x20;v.69,&#x20;pp.163&#x20;-&#x20;+</dcvalue>
<dcvalue element="citation" qualifier="title">INTEGRATED&#x20;FERROELECTRICS</dcvalue>
<dcvalue element="citation" qualifier="volume">69</dcvalue>
<dcvalue element="citation" qualifier="startPage">163</dcvalue>
<dcvalue element="citation" qualifier="endPage">+</dcvalue>
<dcvalue element="description" qualifier="journalRegisteredClass">scie</dcvalue>
<dcvalue element="description" qualifier="journalRegisteredClass">scopus</dcvalue>
<dcvalue element="identifier" qualifier="wosid">000226933000019</dcvalue>
<dcvalue element="identifier" qualifier="scopusid">2-s2.0-29144473730</dcvalue>
<dcvalue element="relation" qualifier="journalWebOfScienceCategory">Engineering,&#x20;Electrical&#x20;&amp;&#x20;Electronic</dcvalue>
<dcvalue element="relation" qualifier="journalWebOfScienceCategory">Physics,&#x20;Applied</dcvalue>
<dcvalue element="relation" qualifier="journalWebOfScienceCategory">Physics,&#x20;Condensed&#x20;Matter</dcvalue>
<dcvalue element="relation" qualifier="journalResearchArea">Engineering</dcvalue>
<dcvalue element="relation" qualifier="journalResearchArea">Physics</dcvalue>
<dcvalue element="type" qualifier="docType">Article;&#x20;Proceedings&#x20;Paper</dcvalue>
<dcvalue element="subject" qualifier="keywordPlus">SILICON</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">piezoelectric</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">PZT&#x20;thick&#x20;film</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">MEMS</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">cantilever</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">biochip</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">photosensitive</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">self&#x20;pattern-able</dcvalue>
<dcvalue element="subject" qualifier="keywordAuthor">sol</dcvalue>
</dublin_core>
