Choi, HW Moon, MW Kim, TY Lee, KR Oh, KH 2024-01-21T05:10:21Z 2024-01-21T05:10:21Z 2021-09-05 2005-04 0255-5476 https://pubs.kist.re.kr/handle/201004/136587 The thermal annealing effect on the compressive residual stress has been presented in thin diamond-like carbon (DLC) film on Si substrate. Annealing experiments were carried out with Rapid Thermal Procedure system at from 200 to 600 degrees C, and the variation of residual stress with annealing temperature was investigated by in-situ stress measurement system. The stress reduction occurs as annealing temperature increases, while the change of chemical structure of DLC film is not significantly changed with observation by Raman spectrometer. The elastic modulus and hardness are not deteriorated when annealing temperature is controlled at less than 400 degree of Celsius, where the residual stress is apparently reduced. English TRANS TECH PUBLICATIONS LTD AMORPHOUS-CARBON STABILITY The thermal annealing effect on the residual stress and mechanical property in the compressive stressed DLC film. Article 10.4028/www.scientific.net/MSF.475-479.3619 1 PRICM 5: THE FIFTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, PTS 1-5, v.475-479, pp.3619 - 3622 PRICM 5: THE FIFTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, PTS 1-5 475-479 3619 3622 scie scopus 000227494704064 2-s2.0-17144397231 Materials Science, Multidisciplinary Metallurgy & Metallurgical Engineering Materials Science Metallurgy & Metallurgical Engineering Article; Proceedings Paper AMORPHOUS-CARBON STABILITY thermal annealing stress reduction diamond-like carbon compressive stress