Moon, MW Kim, TY Lee, KR Oh, KH 2024-01-21T05:10:27Z 2024-01-21T05:10:27Z 2021-09-05 2005-04 0255-5476 https://pubs.kist.re.kr/handle/201004/136589 The evaluation of elastic property for thin diamond-like carbon (DLC) films has been presented with buckle analysis of compressive stressed film on patterned substrate. When substrate has been patterned with adhesion release layer, the morphologies of buckle configuration on patterned layer has been controlled from straight sided (Euler) buckle to nonlinear telephone cord type buckle with respect to the pattern width. By using the simple equation for Euler buckle, the elastic modulus has been easily calculated, shown well consistent with the results by nano-indentation test. English TRANS TECH PUBLICATIONS LTD CARBON-FILMS STRESS DECOMPOSITION DELAMINATION ADHESION CRACKING MODULUS The evaluation of the elastic property in nano-scaled thin compressive film on patterned substrates Article 10.4028/www.scientific.net/MSF.475-479.3935 1 PRICM 5: THE FIFTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, PTS 1-5, v.475-479, pp.3935 - 3938 PRICM 5: THE FIFTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, PTS 1-5 475-479 3935 3938 scie scopus 000227494704140 2-s2.0-17044438254 Materials Science, Multidisciplinary Metallurgy & Metallurgical Engineering Materials Science Metallurgy & Metallurgical Engineering Article; Proceedings Paper CARBON-FILMS STRESS DECOMPOSITION DELAMINATION ADHESION CRACKING MODULUS patterned substrate Euler buckle elastic modulus