신지영 손영석 김상민 이대영 2024-01-21T06:42:39Z 2024-01-21T06:42:39Z 2021-09-06 2004-07 1229-6422 https://pubs.kist.re.kr/handle/201004/137441 Rapid development of electronic technology requires small size, high density packaging and high power of electronic devices, which result in more heat generation by the electronic system. Present cooling technology may not be adequate for the thermal management in the current state-of-the-art electronic equipment. Forced convective heat transfer in a channel filled with pin-fin array is studied experimentally in this paper as an alternative cooling scheme for a high heat-dissipating equipment. Various configurations of the pin-fin array are selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer and pressure drop characteristics. In the low porosity region, interfacial heat transfer and pressure drop seem to show different trend compared to the conventional heat transfer process. 대한설비공학회 핀-휜을 삽입한 채널의 열전달 및 압력강하 특성 실험 Experiments on the Heat Transfer and Pressure Drop Characteristics of a Channel with Pin-Fin Array Article 2 설비공학 논문집, v.16, no.7, pp.623 - 629 설비공학 논문집 16 7 623 629 kci ART001101512 전자장비 냉각기술 핀-휜 배열 다공도 Electronic device Cooling technology Pin-fin array Porosity