Park, JY Kim, KT Shin, HJ Moon, S Pak, JJ 2024-01-21T07:04:18Z 2024-01-21T07:04:18Z 2021-09-02 2004-06 0021-4922 https://pubs.kist.re.kr/handle/201004/137558 In this paper, we report a uncooled infrared sensor coupled with a 3-dimensional (3D) feed-horn shape micro-electromechanical system (MEMS) antenna using novel UV lithography technique for fabricating a 3D feed-horn-shaped mold array, obtaining parallel light using a mirror-reflected parallel-beam illuminator (MRPBI) system and plastic micromaching. The microassembly of infrared detector and 3D feed-horn-shaped antenna arrays is difficult using the conventional MEMS bonding process. To overcome limitation, the proposed novel 3D MEMS bonding technique is mesh structure bonding (MSB) using microchannels with micromolding in capillaries by polydimethylsiloxane (PDMS). The feasibility of fabricating both a 3D feed-horn MEMS antenna and a mold array was demonstrated. As a result, it seems possible to use a 3D feed-horn-shaped MEMS antenna to improve uncooled infrared sensor performance and applications to fabricate MEMS device. English JAPAN SOC APPLIED PHYSICS Feed-horn antenna for enhanced uncooled infrared sensor using novel UV lithography, plastic micromachining and mesh structure bonding Article 10.1143/JJAP.43.3320 1 JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, v.43, no.6A, pp.3320 - 3327 JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS 43 6A 3320 3327 scie scopus 000222503400012 2-s2.0-4344598981 Physics, Applied Physics Article 3D MEMS antenna mesh structure bonding mirror-reflected parallel-beam illuminator system infrared sensor