Lee, DJ Moon, SI Lee, YH Ju, BK 2024-01-21T07:08:55Z 2024-01-21T07:08:55Z 2021-09-02 2004-05 0013-4651 https://pubs.kist.re.kr/handle/201004/137644 In this work, we have improved vacuum in- line sealing technologies for plasma display panels ( PDPs) using the direct- joint packaging method, which is different from the conventional packaging method in the aspects of exhaust hole and tube. We use the glass frit and B- stage organic binder materials for packaging. The sintering process is performed for both materials before packaging to reduce out- gassing and to optimize conditions. To get the high vacuum conductance, we suggest the lump structure on seal- line. The vacuum conductance using lump structures provides better pumping efficiency than tube packaging by theoretical calculation. The packaging temperatures for glass frit and organic binder are 380 and 175degreesC, respectively. The 4 in. alternating current (ac)- PDP is successfully packaged in He- Ne(27%)- Xe(3%) ambient and fully emitted with brightness of about 1000 cd/ m(2). The long- term reliability of packaged PDP is evaluated through both the light emission characteristics and a driving test for one year. This method has the advantages of a simple, brief, low cost process, improved gas uniformity by high vacuum efficiency, and thin panel fabrication achieved by the removal of the exhaust hole and tube. (C) 2004 The Electrochemical Society. English ELECTROCHEMICAL SOC INC Thin AC-PDP vacuum in-line sealing using direct-joint packaging method Article 10.1149/1.1695386 1 JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.151, no.5, pp.H128 - H132 JOURNAL OF THE ELECTROCHEMICAL SOCIETY 151 5 H128 H132 scie scopus 000221436900067 2-s2.0-2942615531 Electrochemistry Materials Science, Coatings & Films Electrochemistry Materials Science Article