Yoon, JK Byun, JY Kim, GH Lee, JK Yoon, HS Hong, KT 2024-01-21T08:44:13Z 2024-01-21T08:44:13Z 2021-09-03 2003-05-22 0257-8972 https://pubs.kist.re.kr/handle/201004/138560 The formation process and microstructural evolution of Ni-silicide layers formed by chemical vapour deposition (CVD) of Si on Ni substrate at deposition temperatures between 900 and 1050 degreesC using horizontal hot-wall reactor and SiCl4-H-2 gas mixtures was investigated. The Ni-silicide layers grew sequentially in a series of gamma-Ni5Si2, delta-Ni2Si and theta-Ni2Si layers with increasing deposition time. After an incubation time necessary for nucleation of each Ni-silicide phase, the growth kinetics of each layer obeyed a parabolic rate law and was controlled by solid-state diffusion of Ni leading to void formation at the interface of the Ni-silicide layers and the Ni substrate. The growth rates of gamma-Ni5Si2 and delta-Ni2Si layers were faster at the early deposition stage than those at the later deposition stage. The formation process and microstructures of each Ni-silicide layer was influenced by the effect of deposition parameters especially on the difference between the Si flux supplied by CVD process and the Ni flux diffusing through each Ni-silicide layer. (C) 2003 Elsevier Science B.V. All rights reserved. English ELSEVIER SCIENCE SA THIN-FILM DIFFUSION NICKEL NI2SI Formation process and microstructural evolution of Ni-silicide layers grown by chemical vapor deposition of Si on Ni substrates Article 10.1016/S0257-8972(03)00269-X 1 SURFACE & COATINGS TECHNOLOGY, v.168, no.2-3, pp.241 - 248 SURFACE & COATINGS TECHNOLOGY 168 2-3 241 248 scie scopus 000182195800021 2-s2.0-0037461468 Materials Science, Coatings & Films Physics, Applied Materials Science Physics Article THIN-FILM DIFFUSION NICKEL NI2SI formation process microstructure evolution CVD of Si Ni-silicides nickel