Lee, HW Jun, HW Kim, J Song, H Ha, J 2024-01-21T09:10:29Z 2024-01-21T09:10:29Z 2022-01-11 2003-03 1013-9826 https://pubs.kist.re.kr/handle/201004/138752 Large-size RBSC components have been successfully fabricated in near-net-dimension by eliminating process shrinkages. Forming shrinkages were substantially decreased to negligible level by thermoset molding, while sintering shrinkage was almost completely eliminated by reaction infiltration. Powder-resin mixture with sufficient fluidity was used to form a radiant tube by powder transfer molding, while homogeneous granules in dry state were used to form a pile with multiple notches for a wafer carrier by powder compression molding. Green joining was employed to fabricate a wafer carrier by applying a rapidly curing paste between two,end plates and four piles with multiple slots. Reaction infiltration was completed using a concept of contact infiltration which established planar contacts between the preform and reservoir with subdued liquid agglomeration. English TRANS TECH PUBLICATIONS LTD BONDED SILICON-CARBIDE ADVANCED STRUCTURAL CERAMICS COMMERCIALIZATION INFILTRATION NECESSITY PATIENCE MELT Low-cost production of large RBSC components by plastic forming processes Article 10.4028/www.scientific.net/KEM.247.95 1 ADVANCED CERAMICS AND COMPOSITES, v.247, pp.95 - 100 ADVANCED CERAMICS AND COMPOSITES 247 95 100 scie scopus 000185045800018 2-s2.0-0042515041 Materials Science, Ceramics Materials Science, Characterization & Testing Materials Science, Composites Materials Science Article; Proceedings Paper BONDED SILICON-CARBIDE ADVANCED STRUCTURAL CERAMICS COMMERCIALIZATION INFILTRATION NECESSITY PATIENCE MELT contact infiltration near-net shaping RBSC thermoset molding