Yang, YS Kim, HY Chun, JH 2024-01-21T09:12:42Z 2024-01-21T09:12:42Z 2021-09-03 2003-03 1521-3331 https://pubs.kist.re.kr/handle/201004/138793 This, work develops a model to predict the spreading and solidification of solder droplets deposited on a, solid pad in the solder jet bumping process. The variational principle, is employed to solve the fluid flow and the semi-solid phase is modeled as a non-Newtonian slurry. This modeling greatly saves the computational expenses of conventional numerical procedures. The simulations reveal that the substrate temperatuer is the single dominant controlling parameter that determines,the final bump diameter (or height) when the substrate possesses a high effusivity. When the effusivity of a substrate is relatively low, both the substrate temperature and the droplet temperature at impact play important roles in determining the final bump diameter. Our model can be used in designing the experimental conditions to find the optimal process conditions for a desired bump geometry. English IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC DEPOSITION DROPLETS SUBSTRATE Spreading and solidification of a molten microdrop in the solder jet bumping process Article 10.1109/TCAPT.2002.806786 1 IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.26, no.1, pp.215 - 221 IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 26 1 215 221 scie scopus 000183393800027 2-s2.0-0038481220 Engineering, Manufacturing Engineering, Electrical & Electronic Materials Science, Multidisciplinary Engineering Materials Science Article DEPOSITION DROPLETS SUBSTRATE area-array packaging recoiling solder bump variational principle