Choi, IS Park, YJ Joo, YC 2024-01-21T11:06:37Z 2024-01-21T11:06:37Z 2021-09-05 2002-02-01 1359-6462 https://pubs.kist.re.kr/handle/201004/139775 With different locations of a cluster, stress evolutions at a via are simulated. Via fails fastest at a specific location of a cluster, which is named fastest stress enhancing polygranular cluster position (FaSEPP). Suggested model and simulated results show that FaSEPP decreases with increasing current density but does not vary with temperature. (C) 2002 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved. English PERGAMON-ELSEVIER SCIENCE LTD CONFINED METAL LINES STRESS EVOLUTION INTERCONNECTS RELIABILITY CONDUCTORS Electromigration-induced via failure assisted by neighboring clusters Article 10.1016/S1359-6462(01)01235-0 1 SCRIPTA MATERIALIA, v.46, no.3, pp.247 - 251 SCRIPTA MATERIALIA 46 3 247 251 scie scopus 000175508300012 2-s2.0-0036466892 Nanoscience & Nanotechnology Materials Science, Multidisciplinary Metallurgy & Metallurgical Engineering Science & Technology - Other Topics Materials Science Metallurgy & Metallurgical Engineering Article CONFINED METAL LINES STRESS EVOLUTION INTERCONNECTS RELIABILITY CONDUCTORS electromigration computer simulatiom interconnects