Lee, BJ Ahn, BT Lee, JK Baik, YJ 2024-01-21T11:33:56Z 2024-01-21T11:33:56Z 2021-09-05 2001-12 0925-9635 https://pubs.kist.re.kr/handle/201004/139998 The conduction path in as-grown undoped diamond films deposited by chemical vapor deposition has been investigated by employing impedance spectroscopy, electroplating and electroetching. The thickness- and direction-dependencies of electrical resistivity did not agree with the previously known surface conduction model. The Cu electroplating and Ag electroetching results showed that the current path followed the grain boundaries within the diamond films. The Cu electroplating of diamond film with an insulating surface layer also showed that the grain boundaries within the films were the main conduction path in undoped polycrystalline films. (C) 2001 Elsevier Science B.V. All rights reserved. English ELSEVIER SCIENCE SA HYDROGEN TRANSPORT A study on the conduction path in undoped polycrystalline diamond films Article 10.1016/S0925-9635(01)00503-9 1 DIAMOND AND RELATED MATERIALS, v.10, no.12, pp.2174 - 2177 DIAMOND AND RELATED MATERIALS 10 12 2174 2177 scie scopus 000172388800013 2-s2.0-0035576958 Materials Science, Multidisciplinary Materials Science, Coatings & Films Physics, Applied Physics, Condensed Matter Materials Science Physics Article HYDROGEN TRANSPORT undoped polycrystalline diamond films conduction path impedance spectroscopy electroplating electroetching