Park, YJ Joo, YC 2024-01-21T12:15:15Z 2024-01-21T12:15:15Z 2021-09-05 2001-05-25 1359-6462 https://pubs.kist.re.kr/handle/201004/140473 English PERGAMON-ELSEVIER SCIENCE LTD CONFINED METAL LINES INDUCED FAILURE INTERCONNECTS EVOLUTION RELIABILITY DEPENDENCE SIMULATION Electromigration-induced stress interaction between vias and polygranular clusters Article 10.1016/S1359-6462(01)00674-1 1 SCRIPTA MATERIALIA, v.44, no.10, pp.2497 - 2501 SCRIPTA MATERIALIA 44 10 2497 2501 scie scopus 000169857600020 2-s2.0-0035946870 Nanoscience & Nanotechnology Materials Science, Multidisciplinary Metallurgy & Metallurgical Engineering Science & Technology - Other Topics Materials Science Metallurgy & Metallurgical Engineering Article CONFINED METAL LINES INDUCED FAILURE INTERCONNECTS EVOLUTION RELIABILITY DEPENDENCE SIMULATION electromigration computer simulation interconnects aluminum