Choi, HJ Kim, HJ Lee, JG Kim, YW 2024-01-21T12:36:58Z 2024-01-21T12:36:58Z 2021-09-04 2001-04 0955-2219 https://pubs.kist.re.kr/handle/201004/140598 Slow crack growth behavior of two gas pressure sintered Si3N4 ceramics with different additives; a Yb2Si2O7 composition and an Al2O3-Y2O3 composition, was investigated by constant stress-rate ("dynamic fatigue") testing at 1400 degreesC. The slow crack growth parameter. n, was 14.7 and 6.3 for Si3N4 With Yb2Si2O7 and Al2O3-Y2O3 compositions, respectively. Superior crack growth resistance of Si3N4 with Yb2Si2O7 composition was due to its higher refractoriness of intergranular glassy films, compared to Si3N4 with Al2O3-Y2O3 composition. (C) 2001 Elsevier Science Ltd. All rights reserved. English ELSEVIER SCI LTD SILICON-NITRIDE CERAMICS OXIDATION BEHAVIOR STRENGTH SYSTEM FILMS Slow crack growth behavior in Si3N4 sintered with Yb2Si2O7 tie-line composition additives Article 10.1016/S0955-2219(00)00218-1 1 JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, v.21, no.4, pp.471 - 475 JOURNAL OF THE EUROPEAN CERAMIC SOCIETY 21 4 471 475 scie scopus 000167481900004 2-s2.0-0035309652 Materials Science, Ceramics Materials Science Article SILICON-NITRIDE CERAMICS OXIDATION BEHAVIOR STRENGTH SYSTEM FILMS engine components grain boundaries Si3N4 sintering additives thermal properties