Choi, SW Choi, WB Lee, YH Ju, BK Kim, BH 2024-01-21T12:41:04Z 2024-01-21T12:41:04Z 2021-09-05 2001-03 0374-4884 https://pubs.kist.re.kr/handle/201004/140672 Oxygen plasma surface treatment of silicon and glass was studied for improving the characteristics of anodic bonding. By using the sessile drop method, we confirmed that the surfaces activated by the oxygen plasma were rendered hydrophilic even at low r.f. power or short plasma exposure time. With increasing plasma power and exposure time the surface roughness was observed to increase. The oxygen plasma treatment was significantly efficient in reducing the impurities on the surface, which caused degradation in the bonding strength and the electrical property in interface. In the tensile test, the oxygen plasma treatment led to a higher bonding strength than the conventional anodic bonding method. English KOREAN PHYSICAL SOC TEMPERATURE Effect of oxygen plasma treatment on anodic bonding Article 1 JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.38, no.3, pp.207 - 209 JOURNAL OF THE KOREAN PHYSICAL SOCIETY 38 3 207 209 scie scopus kci other 000167502800010 2-s2.0-0035532355 Physics, Multidisciplinary Physics Article TEMPERATURE oxygen