Lee, DJ Ju, BK Jang, J Lee, KB Oh, MH 2024-01-21T14:43:23Z 2024-01-21T14:43:23Z 2021-09-05 1999-12 0960-1317 https://pubs.kist.re.kr/handle/201004/141807 This paper presents a study of the anodic bonding technique using a hydrophilic surface. Our method differs from conventional processes in the pre-treatment of the wafer. Hydrophilic surfaces were achieved from dipping in H2O/H2O2/NH4OH solution. The hydrophilic surface has a large number of -OH groups, which can form hydrogen bonds when two wafers are in contact. This induces a higher electrostatic force, because of the decreasing gap between the glass and silicon wafer. We achieved improved properties, such as a wider bonded area and a higher bond strength than those of conventional methods. Also, the fabricated pressure sensors on the 5-inch silicon wafer were bonded to Pyrex #7740 glass of 3 mm thickness. In order to investigate the migration of the sodium ions, the depth profile at the glass surface by secondary-ion mass spectroscopy and the bonding current were compared with that of conventional methods. English IOP PUBLISHING LTD SILICON Effects of a hydrophilic surface in anodic bonding Article 10.1088/0960-1317/9/4/305 1 JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.9, no.4, pp.313 - 318 JOURNAL OF MICROMECHANICS AND MICROENGINEERING 9 4 313 318 scie scopus 000084491500005 2-s2.0-0033345095 Engineering, Electrical & Electronic Nanoscience & Nanotechnology Instruments & Instrumentation Physics, Applied Engineering Science & Technology - Other Topics Instruments & Instrumentation Physics Article SILICON MEMS