평재협 이상배 신종덕 2024-01-21T16:08:37Z 2024-01-21T16:08:37Z 2022-01-10 1999-01 1229-6376 https://pubs.kist.re.kr/handle/201004/142555 대한전자공학회 Characteristics of a solder-clad FBG temperature sensor 땜납이 용융 부착된 FBG 온도 센서의 특성 Article 2 대한전자공학회논문지 CI = Journal of the Institute of Electronics Engineers of Korea CI, v.36D, pp.45 - 50 대한전자공학회논문지 CI = Journal of the Institute of Electronics Engineers of Korea CI 36D 45 50 광섬유