Ju, BK Lee, YH Oh, MH 2024-01-21T16:35:50Z 2024-01-21T16:35:50Z 2021-09-03 1998-11 0026-2692 https://pubs.kist.re.kr/handle/201004/142787 By using a substrate transferring technique, poly-diamond thick films having a smooth or rough surface could be fabricated as field emitter materials. The diamond film with a smooth surface, which was transferred from the interface between the (100) Si substrate and poly diamond deposited by plasma-enhanced CVD, showed better field emission properties in terms of emission current density with improved vacuum level dependence as compared with original poly-diamond film from a rough surface. (C) 1998 Elsevier Science Ltd. All rights reserved. English ELSEVIER ADVANCED TECHNOLOGY Fabrication and field emission properties of poly-diamond films Article 10.1016/S0026-2692(98)00018-4 1 MICROELECTRONICS JOURNAL, v.29, no.11, pp.855 - 859 MICROELECTRONICS JOURNAL 29 11 855 859 scie scopus 000075348100014 2-s2.0-0032209982 Engineering, Electrical & Electronic Nanoscience & Nanotechnology Engineering Science & Technology - Other Topics Article field emission diamond film