Ju, BK Choi, WB Lee, YH Jung, SJ Lee, NY Han, JI Cho, KI Oh, MH 2024-01-21T16:36:07Z 2024-01-21T16:36:07Z 2021-09-03 1998-11 0026-2692 https://pubs.kist.re.kr/handle/201004/142792 Two ITO-coated glass wafers (Corning #7740, #0080) are successfully bonded by the typical Si-Pyrex electrostatic bonding mechanism. Both Si=#7740 and Ti-(Li-doped SiO2) interlayer systems can be employed for the electrostatic bonding of #7059-#7059 and #0080-#0080 glass wafer pairs. This glass-to-glass electrostatic bonding process can be applied to the clean and tubeless packaging of field emission display panels. (C) 1998 Elsevier Science Ltd. All rights reserved. English ELSEVIER ADVANCED TECHNOLOGY Glass-to-glass electrostatic bonding for FED tubeless packaging application Article 10.1016/S0026-2692(97)00119-5 1 MICROELECTRONICS JOURNAL, v.29, no.11, pp.839 - 844 MICROELECTRONICS JOURNAL 29 11 839 844 scie scopus 000075348100012 2-s2.0-0032209966 Engineering, Electrical & Electronic Nanoscience & Nanotechnology Engineering Science & Technology - Other Topics Article MEMS